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CD4055BM96

Texas Instruments

CD4055BM96 by Texas Instruments

CD4055BM96 by Texas Instruments is a CMOS graphics display driver with 7 segments, operating at temperatures from -55 to 125°C. It has a small outline package style, GULL WING terminals, and requires 5/15V power supply. Ideal for liquid crystal displays in military-grade applications due to its compact size and low max supply current of 3mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,823 parts In-Stock

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Digiode

USA . 3,721 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 454 parts In-Stock

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$0.253

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$0.243

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$0.243

Northwest PG Solutions

USA . 1,539 parts In-Stock

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$0.278

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$0.245

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Parana Technologies

USA . 1,067 parts In-Stock

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$7.237

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$7.740

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$7.237

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DigiPath Technology Company

USA . 1,179 parts In-Stock

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$7.968

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$7.331

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ChromeModa Solutions

Germany . 3,257 parts In-Stock

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$8.131

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$6.667

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IDEA Electronic Components Group

UK . 1,712 parts In-Stock

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$8.131

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$7.318

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AZTECH Wire

Italy . 584 parts In-Stock

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$11.377

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One Stop Electronics

USA . 1,326 parts In-Stock

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$34.500

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

USA . 3,221 parts In-Stock

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Microchip USA

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Overview

Enhance your display projects with the CD4055BM96 from Texas Instruments, a leading manufacturer known for top-quality products in the graphics display drivers category. This versatile component offers seamless integration, efficient power supplies, and a compact package style, making it ideal for a wide range of applications. From consumer electronics to automotive displays, this product delivers exceptional value, reliability, and performance. Upgrade your designs with the CD4055BM96 and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, making it suitable for a variety of applications.

Display Mode: SEGMENT

Segment display mode provides clear and easy-to-read information, making it ideal for applications where information needs to be displayed in a segmented format.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

Power Supplies (V): 5/15

Support for both 5V and 15V power supplies offers flexibility in power options, accommodating a wider range of system requirements.

No. of Terminals: 16

With 16 terminals, the display driver can support various connections and functionalities, making it versatile for different applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact designs and applications with size constraints.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability and performance in demanding environments where temperature can fluctuate.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the display driver to function effectively in cold conditions, making it versatile for various operating environments.

Temperature Grade: MILITARY

The military-grade temperature grade ensures durability and performance even in harsh environments, ideal for applications that require rugged and reliable components.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, contributing to efficient and reliable operation of the display driver.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical support and easy soldering capabilities, ensuring stable connections and reliability.

No. of Segments: 7

With 7 segments, the display driver can display a wide range of characters and symbols, making it versatile for various display applications.

Interface IC Type: LIQUID CRYSTAL DISPLAY DRIVER

The interface IC type specifically designed for liquid crystal displays ensures compatibility and optimal performance with LCD screens, making it a suitable choice for display applications.

Technical Specifications

Graphics Display Drivers CD4055BM96 attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Backplanes:

0-BP

No. of Functions:

1

No. of Segments:

7

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

3 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD4055BM96 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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