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CD4055BMT

Texas Instruments

CD4055BMT by Texas Instruments

CD4055BMT by Texas Instruments is a CMOS graphics display driver with 7 segments, operating at temperatures from -55 to 125°C. It features a small outline package style, Gull Wing terminal form, and requires 3mA supply current. Ideal for liquid crystal displays in military-grade applications.

Median Price

$0.358

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$0.358

1k+ parts

$0.297

10k+ parts

$0.265

2,500

-

$0.358

$0.297

$0.265

DigiKey

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.300

10k+ parts

-

2,500

-

-

$0.300

-

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.402

10k+ parts

$0.371

2,500

-

-

$0.402

$0.371

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.261

100+ parts

-

1k+ parts

-

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100

$0.261

-

-

-

Digiode

USA . 4,099 parts In-Stock

1+ parts

$0.277

100+ parts

-

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4,099

$0.277

-

-

-

Vyrian

USA . 2,338 parts In-Stock

1+ parts

-

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2,338

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,307 parts In-Stock

1+ parts

$0.248

100+ parts

-

1k+ parts

-

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-

2,307

$0.248

-

-

-

Argo Parts USA

USA . 4,234 parts In-Stock

1+ parts

$0.261

100+ parts

-

1k+ parts

-

10k+ parts

$0.253

4,234

$0.261

-

-

$0.253

Continental Prestige Electronics

USA . 2,917 parts In-Stock

1+ parts

$0.261

100+ parts

-

1k+ parts

-

10k+ parts

$0.256

2,917

$0.261

-

-

$0.256

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.261

100+ parts

$0.256

1k+ parts

-

10k+ parts

-

50

$0.261

$0.256

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Corphita

USA . 3,205 parts In-Stock

1+ parts

$0.263

100+ parts

-

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3,205

$0.263

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Component Stockers USA

USA . 2,613 parts In-Stock

1+ parts

$0.300

100+ parts

$0.280

1k+ parts

$0.260

10k+ parts

-

2,613

$0.300

$0.280

$0.260

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Parana Technologies

USA . 518 parts In-Stock

1+ parts

$10.049

100+ parts

-

1k+ parts

$10.607

10k+ parts

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518

$10.049

-

$10.607

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DigiPath Technology Company

USA . 706 parts In-Stock

1+ parts

$11.065

100+ parts

$10.180

1k+ parts

-

10k+ parts

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706

$11.065

$10.180

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-

ChromeModa Solutions

Germany . 4,262 parts In-Stock

1+ parts

$11.291

100+ parts

$9.259

1k+ parts

-

10k+ parts

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4,262

$11.291

$9.259

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IDEA Electronic Components Group

UK . 329 parts In-Stock

1+ parts

$11.291

100+ parts

$10.726

1k+ parts

$10.162

10k+ parts

-

329

$11.291

$10.726

$10.162

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Microchip USA

USA . 3,684 parts In-Stock

1+ parts

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100+ parts

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3,684

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Overview

Elevate your graphics display with the CD4055BMT by Texas Instruments, a high-quality liquid crystal display driver that offers unparalleled performance and reliability. Designed with advanced CMOS technology, this small outline package incorporates 7 segments for seamless graphic display. With a military-grade temperature grade and dual terminal position, this product ensures optimal functionality in extreme conditions. Experience the value of Texas Instruments' expertise in graphics display drivers and unlock the potential of your applications with the CD4055BMT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and flexibility, making the product suitable for various applications.

Display Mode: SEGMENT

The segment display mode allows for clear and easy-to-read information on the screen, making it user-friendly.

Surface Mount: YES

The surface mount feature makes installation quick and simple, reducing assembly time and cost.

Package Shape: RECTANGULAR

The rectangular shape of the package ensures efficient use of space, making it ideal for compact electronic devices.

Power Supplies (V): 5/15

With dual power supply options, this product can be versatile and adaptable to different power requirements.

No. of Terminals: 16

The ample number of terminals allows for easy connections and integration into complex systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and weight, making it suitable for portable devices.

No. of Backplanes: 0-BP

The absence of backplanes simplifies the design and operation of the product, enhancing reliability.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can endure harsh environments and conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures reliable performance even in cold climates.

Technical Specifications

Graphics Display Drivers CD4055BMT attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Backplanes:

0-BP

No. of Functions:

1

No. of Segments:

7

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

3 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD4055BMT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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