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CD4054BMT

Texas Instruments

CD4054BMT by Texas Instruments

CD4054BMT by Texas Instruments is a graphics display driver with 16 terminals, operating at -55 to 125 °C. It supports segment display mode and parallel data input, with a max supply voltage of 18 V. Ideal for military-grade applications requiring liquid crystal display drivers in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,271 parts In-Stock

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6,271

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Digiode

USA . 3,728 parts In-Stock

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3,728

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Distributors (Availability)

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One Stop Electronics

USA . 1,155 parts In-Stock

1+ parts

$0.500

100+ parts

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1,155

$0.500

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Parana Technologies

USA . 935 parts In-Stock

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$8.893

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$9.571

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935

$8.893

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$9.571

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DigiPath Technology Company

USA . 467 parts In-Stock

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$9.792

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$9.009

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467

$9.792

$9.009

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ChromeModa Solutions

Germany . 4,574 parts In-Stock

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$9.992

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$8.193

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4,574

$9.992

$8.193

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IDEA Electronic Components Group

UK . 1,752 parts In-Stock

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$9.992

100+ parts

$9.492

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$8.993

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1,752

$9.992

$9.492

$8.993

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Native Components

USA . 434 parts In-Stock

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$12.535

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434

$12.535

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Northwest PG Solutions

USA . 983 parts In-Stock

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$13.788

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$12.410

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983

$13.788

$12.410

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AZTECH Wire

Italy . 671 parts In-Stock

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$16.829

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671

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Corphita

USA . 3,321 parts In-Stock

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Microchip USA

USA . 2,802 parts In-Stock

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Overview

Enhance your display projects with the Texas Instruments CD4054BMT graphics display driver. Manufactured by industry leader Texas Instruments, this product offers unmatched quality and reliability. Ideal for applications requiring segment display mode and parallel data input mode, this driver provides precise control and seamless integration. With a wide supply voltage range and military-grade temperature grade, the CD4054BMT ensures optimal performance in any environment. Trust Texas Instruments to deliver cutting-edge technology and superior products to meet all your display driver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product, making it resistant to shocks and vibrations.

Display Mode: SEGMENT

Segment display mode allows for clear and precise information display, making it suitable for applications where specific data needs to be displayed.

Data Input Mode: PARALLEL

Parallel data input mode enables efficient and fast data transfer between the driver and display, ensuring smooth operation.

Surface Mount: YES

Surface mount capability makes installation easy and reduces overall assembly time, making it a convenient option for manufacturers.

Maximum Supply Voltage: 18 V

With a high maximum supply voltage, this driver can handle demanding power requirements, offering flexibility in various applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for compact and space-saving design, making it suitable for products with limited space constraints.

Power Supplies (V): 5/15

Support for multiple power supply voltages offers flexibility in power management and compatibility with different systems.

No. of Terminals: 16

A sufficient number of terminals enable proper connectivity and functionality, ensuring smooth operation of the display driver.

Package Style (Meter): SMALL OUTLINE

Small outline package style reduces the overall footprint of the product, making it ideal for compact devices and applications.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures efficient power consumption and compatibility with a wide range of power sources.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance in harsh environmental conditions, ensuring durability and longevity.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures the driver can function in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-lasting performance and reliability.

Terminal Position: DUAL

Dual terminal position offers flexibility in installation and connectivity options, allowing for versatile integration into different systems.

Maximum Seated Height: 1.75 mm

Low maximum seated height allows for slim and compact design, making it suitable for applications with space constraints.

Width: 3.9 mm

Narrow width dimension contributes to a compact form factor, making it suitable for products where size is a critical factor.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes the risk of damage to sensitive components during assembly, ensuring high-quality solder joints.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable soldering and robust mechanical connections, enhancing overall product durability.

Length: 9.9 mm

Compact length dimension contributes to a space-saving design, making it suitable for applications with limited physical space.

Temperature Grade: MILITARY

Military-grade temperature rating ensures reliable performance in extreme conditions and environments, making it suitable for rugged applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making it an energy-efficient and reliable choice for display drivers.

Terminal Form: GULL WING

Gull-wing terminal form provides secure connectivity and easy soldering, ensuring reliable electrical connections and ease of assembly.

Maximum Supply Current: 3 mA

Low maximum supply current ensures efficient power usage and minimal heat dissipation, contributing to overall energy efficiency.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources, making it a reliable choice for various applications.

No. of Segments: 4

Support for multiple segments allows for versatile display configurations, enabling customization and flexibility in information display.

Terminal Pitch: 1.27 mm

Standard terminal pitch enables easy integration and compatibility with common connector types, ensuring convenient connectivity options.

Interface IC Type: LIQUID CRYSTAL DISPLAY DRIVER

Specific interface IC type supports seamless communication between the driver and the display, ensuring compatibility and reliable operation.

Technical Specifications

Graphics Display Drivers CD4054BMT attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Data Input Mode:

PARALLEL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

Multiplexed Display Capability:

NO

No. of Backplanes:

0-BP

No. of Functions:

1

No. of Segments:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

3 mA

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD4054BMT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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