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CD4049UBNS

Texas Instruments

CD4049UBNS by Texas Instruments

CD4049UBNS by Texas Instruments is a CMOS logic gate with 6 functions, operating at a supply voltage range of 3-18V. It has a propagation delay of 120ns and can withstand temperatures from -55 to 125°C. This small outline package is ideal for military-grade applications requiring high-speed signal processing.

Median Price

$0.349

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 41 parts In-Stock

1+ parts

$0.420

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41

$0.420

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Rochester

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$0.278

1k+ parts

$0.231

10k+ parts

$0.206

200

-

$0.278

$0.231

$0.206

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 531 parts In-Stock

1+ parts

$0.217

100+ parts

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531

$0.217

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Vyrian

USA . 8,133 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,052 parts In-Stock

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$0.205

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3,052

$0.205

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Microchip USA

USA . 1,899 parts In-Stock

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$1.430

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1,899

$1.430

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Northwest PG Solutions

USA . 1,718 parts In-Stock

1+ parts

$2.563

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1,718

$2.563

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AZTECH Wire

Italy . 906 parts In-Stock

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$9.290

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906

$9.290

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Parana Technologies

USA . 2,146 parts In-Stock

1+ parts

$15.851

100+ parts

$1,471.996

1k+ parts

$14.266

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-

2,146

$15.851

$1,471.996

$14.266

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DigiPath Technology Company

USA . 1,436 parts In-Stock

1+ parts

$17.454

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1,436

$17.454

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ChromeModa Solutions

Germany . 5,879 parts In-Stock

1+ parts

$17.810

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$14.604

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5,879

$17.810

$14.604

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IDEA Electronic Components Group

UK . 2,255 parts In-Stock

1+ parts

$17.810

100+ parts

$16.920

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$16.029

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2,255

$17.810

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$16.029

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Native Components

USA . 637 parts In-Stock

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$2.260

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637

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$2.260

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Overview

Upgrade your electronic designs with the CD4049UBNS logic gates from Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable components that offer superior performance and durability. These logic gates are versatile and can be used in a wide range of applications, making them a valuable addition to any project. Trust Texas Instruments to provide innovative solutions that meet your needs and exceed your expectations. Experience the difference with the CD4049UBNS logic gates today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the internal components of the logic gates, making it a reliable choice for various applications.

No. of Functions: 6

Having 6 functions in a single device allows for compact and efficient integration of multiple logic operations, saving space and reducing the need for multiple components.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes these logic gates compatible with standard electronic systems and easily integrable into existing circuits.

Propagation Delay (tpd): 120 ns

With a low propagation delay of 120 ns, these logic gates offer fast response times, ensuring quick and efficient logic operations in electronic systems.

Maximum Operating Temperature: 125 °C

Being able to operate at a maximum temperature of 125°C ensures the reliability of these logic gates in a wide range of environmental conditions.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making these logic gates energy-efficient and reliable in noise-sensitive applications.

Technical Specifications

Logic Gates CD4049UBNS attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

120 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

CD4049UBNS Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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