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CD4042BPWRE4

Texas Instruments

CD4042BPWRE4 by Texas Instruments

CD4042BPWRE4 by Texas Instruments is a 4-bit latch with 220 ns propagation delay at 5V. It has a small outline package, -55 to 125 °C operating temperature range, and is suitable for military applications. The device features negative edge trigger type and complementary output polarity, making it ideal for high-reliability systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,105 parts In-Stock

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Digiode

USA . 3,701 parts In-Stock

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3,701

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Native Components

USA . 20 parts In-Stock

1+ parts

$0.048

100+ parts

-

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$0.046

20

$0.048

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$0.046

One Stop Electronics

USA . 701 parts In-Stock

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$3.000

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-

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701

$3.000

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Parana Technologies

USA . 1,500 parts In-Stock

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$7.985

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$8.563

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$7.985

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$8.563

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DigiPath Technology Company

USA . 653 parts In-Stock

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$8.793

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$8.089

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653

$8.793

$8.089

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ChromeModa Solutions

Germany . 3,304 parts In-Stock

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$8.972

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$7.357

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$8.972

$7.357

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IDEA Electronic Components Group

UK . 108 parts In-Stock

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$8.972

100+ parts

$8.523

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$8.075

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108

$8.972

$8.523

$8.075

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AZTECH Wire

Italy . 642 parts In-Stock

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$13.691

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$13.691

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Component Stockers USA

USA . 404 parts In-Stock

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$99.990

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404

$99.990

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Microchip USA

USA . 5,250 parts In-Stock

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Corphita

USA . 3,281 parts In-Stock

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Northwest PG Solutions

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Overview

Experience the superior quality and reliability of Texas Instruments with the CD4042BPWRE4 latches & flip-flops. This versatile component offers a wide range of applications, delivering exceptional performance and precision in every use. With a compact package body material of plastic/epoxy and a nominal supply voltage of 5V, this product provides value and efficiency to customers seeking top-tier technology solutions. Trust Texas Instruments for innovation that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the latch durable and resistant to damage, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 220 ns

The low propagation delay ensures fast and efficient operation of the latch, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mountable makes it easy to integrate the latch onto a circuit board, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on a circuit board, enabling a compact design for the overall system.

No. of Bits: 4

Having 4 bits allows the latch to store a range of data or states, providing flexibility in the applications where it can be used.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes it compatible with a wide range of systems and power sources.

Load Capacitance (CL): 50 pF

The low load capacitance ensures minimal power consumption and efficient performance of the latch.

Power Supplies (V): 5/15

The latch can operate at different power supply voltages, providing versatility in system design and compatibility with various power sources.

No. of Terminals: 16

With 16 terminals, the latch can easily connect with other components in a circuit, enabling versatile and complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and streamlined package style saves space on the circuit board and allows for dense packing of components, ideal for compact electronic devices.

Propagation Delay (tpd): 500 ns

While not the fastest, the propagation delay of 500 ns still ensures efficient operation for a wide range of applications without compromising on speed.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes the latch suitable for use in harsh environments or applications that generate heat.

Trigger Type: NEGATIVE EDGE

The negative edge trigger type allows for precise control and triggering of the latch, ensuring accurate and reliable operation.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature enables the latch to function reliably in cold environments without risk of failure or damage.

Terminal Position: DUAL

The dual terminal position provides flexibility in installation and connection methods, accommodating different circuit board layouts and designs.

Maximum Seated Height: 1.2 mm

The low seated height of the latch allows for a slim and compact profile, contributing to space-saving and streamlined circuit designs.

Width: 4.4 mm

The narrow width of the latch enables it to fit into tight spaces on a circuit board, maximizing the use of available space for other components.

Output Polarity: COMPLEMENTARY

The complementary output polarity ensures compatibility with various types of logic circuits, making it versatile and easy to integrate into different systems.

Minimum Supply Voltage (Vsup): 3 V

With a minimum supply voltage of 3V, the latch can operate in low-power settings or with lower voltage power sources, expanding its range of applications.

Length: 5 mm

The short length of the latch contributes to a compact overall design, fitting easily within the constraints of space in modern electronic devices.

Temperature Grade: MILITARY

The military-grade temperature rating ensures that the latch can withstand extreme conditions and harsh environments, making it suitable for rugged applications.

Technology: CMOS

Using CMOS technology offers low power consumption and high noise immunity, making the latch reliable and efficient in various electronic systems.

Terminal Form: GULL WING

The gull wing terminal form enables easy soldering and secure connections on the circuit board, simplifying the manufacturing and assembly process.

Packing Method: TR

The TR packing method ensures safe and secure packaging of the latch for transportation and storage, reducing the risk of damage during handling.

Terminal Pitch: 0.65 mm

With a small terminal pitch of 0.65mm, the latch can be densely packed on a circuit board, maximizing efficiency and space utilization in the system design.

Maximum Supply Voltage (Vsup): 18 V

With a maximum supply voltage of 18V, the latch can handle high voltage applications, offering versatility and compatibility with a wide range of power sources.

Technical Specifications

Latches & Flip-Flops CD4042BPWRE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

PROGRAMMABLE TRIGGER TYPE

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

220 ns

Propagation Delay (tpd):

500 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

NEGATIVE EDGE

Width:

4.4 mm

Trade Compliance

CD4042BPWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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