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CD4042BDWR

Texas Instruments

CD4042BDWR by Texas Instruments

CD4042BDWR by Texas Instruments is a 4-bit latch with 220 ns propagation delay, suitable for military applications. It operates at 5V with -55 to 125 °C temperature range and has a small outline package style. The flip-flop features complementary output polarity and negative edge trigger type, making it ideal for high-speed digital circuits.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 4,673 parts In-Stock

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Digiode

USA . 235 parts In-Stock

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AZTECH Wire

Italy . 888 parts In-Stock

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$11.954

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$11.954

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Parana Technologies

USA . 1,156 parts In-Stock

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$14.503

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$14.944

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DigiPath Technology Company

USA . 722 parts In-Stock

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$15.970

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ChromeModa Solutions

Germany . 3,868 parts In-Stock

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$16.296

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$13.363

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IDEA Electronic Components Group

UK . 860 parts In-Stock

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$16.296

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$15.481

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$14.666

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860

$16.296

$15.481

$14.666

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One Stop Electronics

USA . 854 parts In-Stock

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$35.000

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$35.000

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Microchip USA

USA . 6,617 parts In-Stock

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Corphita

USA . 3,991 parts In-Stock

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Northwest PG Solutions

USA . 2,316 parts In-Stock

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$4.038

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Native Components

USA . 126 parts In-Stock

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Overview

Unlock endless possibilities with the Texas Instruments CD4042BDWR, a top-quality latches & flip-flops component designed for seamless integration in your projects. Manufactured by industry leader Texas Instruments, this product offers unparalleled reliability and durability. Whether you're working on automation, communications, or consumer electronics, this versatile component provides unmatched value, bringing efficiency and performance to your designs. Upgrade your projects today with the Texas Instruments CD4042BDWR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 220 ns

The low propagation delay at nominal supply allows for fast and efficient operation of the latches and flip-flops.

Surface Mount: YES

Being surface mountable makes installation and integration easier and more convenient.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space and easy placement on circuit boards.

No. of Bits: 4

Having 4 bits allows for a higher level of data processing and manipulation.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard nominal supply voltage of 5V, making it compatible with many existing systems.

Load Capacitance (CL): 50 pF

The low load capacitance ensures minimal interference and noise during operation.

Power Supplies (V): 5/15

Supports multiple power supply options, offering flexibility in voltage requirements.

No. of Terminals: 16

With 16 terminals, connectivity options are ample for various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, ideal for compact designs.

Propagation Delay (tpd): 500 ns

Although not the fastest, the propagation delay of 500 ns is still reasonable for most applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in a wide range of environments.

Trigger Type: NEGATIVE EDGE

The negative edge trigger type allows for precise and controlled triggering of the latches and flip-flops.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures functionality even in extreme cold conditions.

Terminal Position: DUAL

The dual terminal position offers flexibility in connecting the latches and flip-flops in various configurations.

Maximum Seated Height: 2.65 mm

The compact maximum seated height reduces the overall size of the product and allows for tight spacing in designs.

Width: 7.5 mm

The moderate width makes it easy to integrate the latches and flip-flops into different circuit board layouts.

Output Polarity: COMPLEMENTARY

The complementary output polarity ensures precise and consistent signal output for accurate data processing.

Minimum Supply Voltage (Vsup): 3 V

Works within a wide voltage range, allowing for compatibility with various power sources.

Length: 10.3 mm

The length of 10.3 mm strikes a balance between compactness and functionality, suitable for most applications.

Temperature Grade: MILITARY

Built to military-grade standards, ensuring durability and performance in harsh environments.

Technology: CMOS

Uses CMOS technology for efficient power consumption and reliable operation.

Terminal Form: GULL WING

The gull wing terminal form offers secure and stable connections, reducing the risk of disconnection during operation.

Packing Method: TR

The TR packing method ensures safe transportation and storage of the latches and flip-flops.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for easy and precise soldering onto the circuit board.

Maximum Supply Voltage (Vsup): 18 V

With a maximum supply voltage of 18V, this product can handle higher voltage requirements when needed.

Technical Specifications

Latches & Flip-Flops CD4042BDWR attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

PROGRAMMABLE TRIGGER TYPE

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

220 ns

Propagation Delay (tpd):

500 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

NEGATIVE EDGE

Width:

7.5 mm

Trade Compliance

CD4042BDWR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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