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CD40174BPWRE4

Texas Instruments

CD40174BPWRE4 by Texas Instruments

CD40174BPWRE4 by Texas Instruments is a 6-bit latch with 300 ns propagation delay, operating at temperatures from -55 to 125 °C. It has a supply voltage of 5V, load capacitance of 50 pF, and can handle frequencies up to 3.5 MHz. Ideal for military applications due to its CMOS technology and small form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,707 parts In-Stock

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Vyrian

USA . 4,639 parts In-Stock

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4,639

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Distributors (Availability)

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AZTECH Wire

Italy . 257 parts In-Stock

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$16.175

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257

$16.175

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Parana Technologies

USA . 813 parts In-Stock

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$28.484

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$48.045

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$28.484

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$48.045

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DigiPath Technology Company

USA . 888 parts In-Stock

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$31.364

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$28.855

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$31.364

$28.855

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ChromeModa Solutions

Germany . 5,935 parts In-Stock

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$32.004

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$26.243

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$32.004

$26.243

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IDEA Electronic Components Group

UK . 1,470 parts In-Stock

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$32.004

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$30.404

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$28.804

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$32.004

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$28.804

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Native Components

USA . 112 parts In-Stock

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$37.305

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$35.813

112

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$35.813

Northwest PG Solutions

USA . 1,354 parts In-Stock

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$41.036

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$41.036

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One Stop Electronics

USA . 1,114 parts In-Stock

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$48.000

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Corphita

USA . 1,562 parts In-Stock

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Microchip USA

USA . 472 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the CD40174BPWRE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality latches & flip-flops that provide reliable performance and exceptional value. Whether you're working on industrial automation, consumer electronics, or telecommunications, this versatile component offers fast switching speeds and low power consumption, making it ideal for a wide range of applications. Trust Texas Instruments to bring innovation to your projects and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the internal components of the latch, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard voltage levels, making it versatile for a wide range of applications.

Propagation Delay (tpd): 300 ns

Fast response time ensures quick and efficient operation of the latch.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in various environments.

Trigger Type: POSITIVE EDGE

Provides precise control over the triggering mechanism, ensuring accurate operation.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, improving overall performance.

Technical Specifications

Latches & Flip-Flops CD40174BPWRE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

3500000 Hz

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

8 MHz

Trade Compliance

CD40174BPWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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