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CD40106BMG4

Texas Instruments

CD40106BMG4 by Texas Instruments

CD40106BMG4 by Texas Instruments is a CMOS logic gate with 6 functions and 1 input. It has a propagation delay of 280 ns at a nominal voltage of 5V. This Schmitt trigger is commonly used in military applications due to its small outline package and wide temperature range.

Median Price

$5.792

Lifecycle Status

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6

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1k+

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Mouser Electronics

USA . 363 parts In-Stock

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$1.890

100+ parts

$0.885

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$0.512

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363

$1.890

$0.885

$0.512

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Adafruit Industries

USA . 350 parts In-Stock

1+ parts

$9.695

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$9.211

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$9.211

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350

$9.695

$9.211

$9.211

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Nova Conductors

Japan . 750 parts In-Stock

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$0.545

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-

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750

$0.545

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Digiode

USA . 2,926 parts In-Stock

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$1.083

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$1.083

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Vyrian

USA . 4,457 parts In-Stock

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4,457

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LIBRA Elektronik GmbH

Germany . 75 parts In-Stock

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75

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Aranea Global

USA . 500 parts In-Stock

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$0.534

100+ parts

-

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$0.513

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500

$0.534

-

$0.513

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Argo Parts USA

USA . 3,824 parts In-Stock

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$0.545

100+ parts

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$0.529

3,824

$0.545

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-

$0.529

Continental Prestige Electronics

USA . 3,585 parts In-Stock

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$0.545

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$0.534

3,585

$0.545

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$0.534

Ampacity Inc.

Singapore . 226 parts In-Stock

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$0.970

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226

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Corphita

USA . 817 parts In-Stock

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Semicontronic

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$1.440

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$1.404

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$1.397

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258

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$9.211

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$9.211

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350

$9.695

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$9.211

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AZTECH Wire

Italy . 502 parts In-Stock

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$10.287

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Parana Technologies

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759

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Corohmni

South Africa . 820 parts In-Stock

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820

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ChromeModa Solutions

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$18.601

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IDEA Electronic Components Group

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$21.550

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$20.416

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943

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$20.416

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Microchip USA

USA . 3,512 parts In-Stock

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Perfect Parts

USA . 1,799 parts In-Stock

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DigiPath Technology Company

USA . 1,662 parts In-Stock

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$20.452

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Robosynatics

Brazil . 500 parts In-Stock

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Lucentia Tech

USA . 500 parts In-Stock

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500

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Overview

Discover the CD40106BMG4 by Texas Instruments, a high-quality logic gates solution that offers unmatched reliability and performance. Designed with cutting-edge CMOS technology, this product boasts a compact design and a wide range of applications, making it perfect for various industries. With its 6 functions, excellent propagation delay, and surface mount capabilities, this versatile device is sure to meet all your needs. Experience the value and advantages of Texas Instruments' superior manufacturing while enjoying the benefits of this exceptional product. Don't miss out on the opportunity to elevate your projects to new heights with the CD40106BMG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This logic gate product is made of plastic/epoxy material, providing durability and resistance to external factors, making it suitable for various environments.

Propagation Delay At Nominal Supply: 280 ns

With a short propagation delay of 280 ns, this logic gate ensures efficient and fast signal processing, improving overall system performance.

Surface Mount: YES

Designed for surface mount applications, this logic gate offers easy and convenient installation, saving time and effort during the assembly process.

No. of Functions: 6

With 6 functions integrated into a single package, this logic gate provides versatility and compactness, reducing component count and PCB footprint.

No. of Inputs: 1

Featuring 1 input, this logic gate is suitable for basic circuits and applications, ideal for simple logic operations.

Package Shape: RECTANGULAR

The rectangular package shape of this logic gate allows for efficient space utilization on the PCB, enabling compact system designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this logic gate is compatible with standard voltage levels, ensuring broad compatibility and ease of use.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this logic gate can drive capacitive loads efficiently, maintaining signal integrity and ensuring reliable operation.

Power Supplies (V): 5/15

This logic gate supports power supplies of 5V and 15V, providing flexibility in voltage selection to accommodate diverse system requirements.

No. of Terminals: 14

With 14 terminals, this logic gate offers ample connectivity options, allowing for easy integration into complex circuit designs.

Package Style (Meter): SMALL OUTLINE

Featuring a small outline package style, this logic gate is space-saving and suitable for applications with tight space constraints.

Maximum I (ol): 2.4 Amp

With a maximum output current of 2.4 Amps, this logic gate can drive high current loads, making it suitable for power-intensive applications.

Propagation Delay (tpd): 280 ns

The propagation delay of 280 ns ensures minimal delay in signal transmission through this logic gate, contributing to overall system speed and responsiveness.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this logic gate is capable of withstanding harsh environmental conditions, enhancing reliability and durability.

Minimum Operating Temperature: -55 °C

This logic gate can operate reliably even in extremely low temperatures as low as -55°C, making it suitable for use in cold environments or extreme weather conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish ensures excellent corrosion resistance and reliable electrical contact, resulting in prolonged product lifespan and consistent performance.

Terminal Position: DUAL

Featuring dual terminal positions, this logic gate provides flexibility in circuit layout and compatibility with different PCB designs.

Maximum Seated Height: 1.75 mm

With a maximum seated height of 1.75 mm, this logic gate offers a low profile design, minimizing space requirements and enabling compact system designs.

Width: 3.9 mm

The narrow width of 3.9 mm makes this logic gate suitable for applications where space is limited, allowing for efficient PCB layout and system miniaturization.

Minimum Supply Voltage (Vsup): 3 V

This logic gate can operate reliably at a minimum supply voltage of 3V, enabling power-efficient designs and compatibility with low-voltage systems.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260°C, this logic gate can withstand the soldering process during assembly, ensuring reliable and consistent solder joints.

Length: 8.65 mm

With a length of 8.65 mm, this logic gate offers a compact form factor, contributing to space-efficient system designs.

Temperature Grade: MILITARY

Designed to meet military-grade specifications, this logic gate offers enhanced reliability, durability, and performance, making it suitable for demanding military applications.

Schmitt Trigger: YES

Featuring a Schmitt trigger, this logic gate provides hysteresis and improved noise immunity, ensuring reliable and stable operation even in noisy environments.

Technology: CMOS

Based on Complementary Metal-Oxide-Semiconductor (CMOS) technology, this logic gate offers low power consumption, high noise immunity, and compatibility with a wide range of applications.

Terminal Form: GULL WING

The gull-wing terminal form of this logic gate enables easy soldering and efficient heat dissipation, ensuring reliable electrical connections and enhanced thermal performance.

Packing Method: TUBE

Packaged in a tube, this logic gate facilitates organized storage, ease of transport, and protection against damage during shipping, ensuring product availability and quality.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this logic gate supports precise and compact PCB designs, enabling high-density integration and efficient signal routing.

Moisture Sensitivity Level (MSL): 1

With a moisture sensitivity level of 1, this logic gate is highly resistant to moisture-related issues, ensuring prolonged shelf life and reliability under varying humidity conditions.

Maximum Supply Voltage (Vsup): 18 V

This logic gate can handle a maximum supply voltage of 18V, allowing for compatibility with systems operating at higher voltage levels.

Maximum Power Supply Current (ICC): 0.12 mA

With a maximum power supply current of 0.12 mA, this logic gate offers low power consumption, making it suitable for energy-efficient designs.

Technical Specifications

Logic Gates CD40106BMG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

2.4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Maximum Power Supply Current (ICC):

.12 mA

Propagation Delay At Nominal Supply:

280 ns

Propagation Delay (tpd):

280 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD40106BMG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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