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CD4009UBMT

Texas Instruments

CD4009UBMT by Texas Instruments

CD4009UBMT by Texas Instruments is a logic gate with 6 functions, 140 ns propagation delay at 5V. It has open-drain output characteristics and operates in temperatures ranging from -55 to 125 °C. Ideal for military-grade applications due to its small outline package style and dual terminal position.

Median Price

$0.440

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 283 parts In-Stock

1+ parts

$0.710

100+ parts

$0.396

1k+ parts

$0.330

10k+ parts

$0.314

283

$0.710

$0.396

$0.330

$0.314

Rochester

USA . 12,250 parts In-Stock

1+ parts

-

100+ parts

$0.385

1k+ parts

$0.320

10k+ parts

$0.285

12,250

-

$0.385

$0.320

$0.285

DigiKey

USA . 12,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.480

10k+ parts

-

12,250

-

-

$0.480

-

Verical

USA . 6,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.400

10k+ parts

$0.356

6,250

-

-

$0.400

$0.356

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 586 parts In-Stock

1+ parts

$0.186

100+ parts

-

1k+ parts

-

10k+ parts

-

586

$0.186

-

-

-

DigiKey Marketplace

USA . 12,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.180

10k+ parts

-

12,250

-

-

$0.180

-

Vyrian

USA . 6,571 parts In-Stock

1+ parts

-

100+ parts

-

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6,571

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 13,899 parts In-Stock

1+ parts

$0.170

100+ parts

$0.160

1k+ parts

$0.150

10k+ parts

$0.150

13,899

$0.170

$0.160

$0.150

$0.150

Corphita

USA . 1,875 parts In-Stock

1+ parts

$0.176

100+ parts

-

1k+ parts

-

10k+ parts

-

1,875

$0.176

-

-

-

Continental Prestige Electronics

USA . 48 parts In-Stock

1+ parts

$0.220

100+ parts

-

1k+ parts

-

10k+ parts

-

48

$0.220

-

-

-

Parana Technologies

USA . 1,180 parts In-Stock

1+ parts

$18.859

100+ parts

-

1k+ parts

$18.938

10k+ parts

-

1,180

$18.859

-

$18.938

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DigiPath Technology Company

USA . 1,594 parts In-Stock

1+ parts

$20.766

100+ parts

$19.105

1k+ parts

-

10k+ parts

-

1,594

$20.766

$19.105

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IDEA Electronic Components Group

UK . 2,033 parts In-Stock

1+ parts

$21.190

100+ parts

$20.130

1k+ parts

$19.071

10k+ parts

-

2,033

$21.190

$20.130

$19.071

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ChromeModa Solutions

Germany . 1,111 parts In-Stock

1+ parts

$21.190

100+ parts

$17.376

1k+ parts

-

10k+ parts

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1,111

$21.190

$17.376

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Northwest PG Solutions

USA . 846 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$4.302

10k+ parts

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846

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-

$4.302

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Native Components

USA . 316 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.258

10k+ parts

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316

-

-

$4.258

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Overview

Elevate your electronic designs with the CD4009UBMT by Texas Instruments, a top-quality logic gate that offers reliability and precision in every application. Crafted by the renowned manufacturer, this versatile component boasts a multitude of functions with a fast propagation delay, making it ideal for a wide range of projects. Whether you're working on industrial automation systems or consumer electronics, this small outline package delivers exceptional performance and efficiency. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the logic gates, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 140 ns

A low propagation delay allows for faster operation and response times in the circuit.

Surface Mount: YES

Surface mount technology enables easy installation and integration of the logic gates onto a circuit board.

No. of Functions: 6

Having multiple functions in one component saves space and simplifies circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage level makes it compatible with a wide range of systems.

Load Capacitance (CL): 50 pF

With a moderate load capacitance, the logic gates can effectively drive connected components without excessive strain.

Power Supplies (V): 5/15

Supporting multiple power supply options gives flexibility in design and application.

No. of Bits: 6

Having a 6-bit architecture allows for more complex logic operations and data processing.

Maximum Seated Height: 1.75 mm

The compact size of the logic gates makes them suitable for applications where space is limited.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for efficient and reliable operation.

Technical Specifications

Logic Gates CD4009UBMT attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

16 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

6

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Maximum Power Supply Current (ICC):

.018 mA

Propagation Delay At Nominal Supply:

140 ns

Propagation Delay (tpd):

140 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD4009UBMT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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