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BUF602IDBVR

Texas Instruments

BUF602IDBVR by Texas Instruments

BUF602IDBVR by Texas Instruments is a 5-terminal Op Amp with max input offset voltage of 38000uV and max bias current of 8.5uA. Ideal for industrial applications, it has a bandwidth of 1000MHz and operates b/w -40 to 85°C.

Median Price

$8.130

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,875 parts In-Stock

1+ parts

$8.130

100+ parts

-

1k+ parts

$5.970

10k+ parts

$3.830

2,875

$8.130

-

$5.970

$3.830

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 89 parts In-Stock

1+ parts

$0.936

100+ parts

-

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89

$0.936

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Chip Stock

USA . 5,810 parts In-Stock

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5,810

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Vyrian

USA . 5,177 parts In-Stock

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5,177

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Digiode

USA . 2,821 parts In-Stock

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2,821

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VNN

France . 2,081 parts In-Stock

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2,081

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Cyclops Electronics Ltd

UK . 849 parts In-Stock

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849

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LIBRA Elektronik GmbH

Germany . 112 parts In-Stock

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112

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,263 parts In-Stock

1+ parts

$0.936

100+ parts

-

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4,263

$0.936

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.936

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-

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1,000

$0.936

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Continental Prestige Electronics

USA . 590 parts In-Stock

1+ parts

$0.936

100+ parts

-

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$0.917

590

$0.936

-

-

$0.917

AZTECH Wire

Italy . 390 parts In-Stock

1+ parts

$5.069

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390

$5.069

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Parana Technologies

USA . 2,252 parts In-Stock

1+ parts

$6.074

100+ parts

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1k+ parts

$6.850

10k+ parts

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2,252

$6.074

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$6.850

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DigiPath Technology Company

USA . 243 parts In-Stock

1+ parts

$6.688

100+ parts

$6.153

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243

$6.688

$6.153

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ChromeModa Solutions

Germany . 3,136 parts In-Stock

1+ parts

$6.825

100+ parts

$5.596

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3,136

$6.825

$5.596

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IDEA Electronic Components Group

UK . 1,906 parts In-Stock

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$6.825

100+ parts

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$6.142

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1,906

$6.825

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$6.142

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Ampacity Inc.

Singapore . 991 parts In-Stock

1+ parts

$7.410

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991

$7.410

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Microchip USA

USA . 2,814 parts In-Stock

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$8.296

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2,814

$8.296

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One Stop Electronics

USA . 181 parts In-Stock

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$8.410

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181

$8.410

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Lixinc

USA . 11,793 parts In-Stock

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11,793

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Kepictronics

USA . 7,772 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,355 parts In-Stock

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Corphita

USA . 1,615 parts In-Stock

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1,615

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Alle Elektronik GmbH

Germany . 1,260 parts In-Stock

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1,260

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Overview

Discover the versatile BUF602IDBVR by Texas Instruments, a high-quality Operational Amplifier designed for a wide range of applications. With a small outline and low profile package style, this amplifier offers customers the advantage of space-saving design and industrial-grade reliability. Experience smooth operation with minimal bias current and a nominal unity gain bandwidth of 540GHz. Whether you're working on audio equipment, instrumentation, or communication systems, the BUF602IDBVR provides exceptional performance and value for your projects. Upgrade your designs today with Texas Instruments' trusted technology and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good thermal stability and durability, making the product suitable for a wide range of operating conditions.

Maximum Input Offset Voltage: 38000 uV

Low input offset voltage ensures accurate signal processing and minimal errors in the output.

Nominal Supply Voltage / Vsup (V): 5

Operates on a commonly available 5V supply voltage, making it compatible with a wide range of systems.

Nominal Unity Gain Bandwidth: 540000000000 kHz

High unity gain bandwidth allows for high-frequency signal amplification and processing, suitable for applications requiring fast response times.

Technology: BIPOLAR

Bipolar technology provides good speed performance and high accuracy, making the operational amplifier suitable for precision applications.

Technical Specifications

Operational Amplifiers (Op Amps) BUF602IDBVR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

1

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

1000 MHz

Nominal Unity Gain Bandwidth:

540000000 MHz

Input Offset Voltage Limit:

38000 uV

Nominal Slew Rate:

8000 V/us

Peak Bias Current:

8.5 uA

Maximum Bias Current (IIB) @25 °C:

7 uA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6.5 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-6.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

5.8 mA

Lowest Output Current:

48 mA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Trade Compliance

BUF602IDBVR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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