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BQ77908DBTR

Texas Instruments

BQ77908DBTR by Texas Instruments

BQ77908DBTR by Texas Instruments is a Power Management IC with 38 terminals, operating b/w -40 to 85°C. It supports supply voltages from 5.6V to 35V and has an adjustable threshold feature. This IC is commonly used in industrial applications for power supply support circuits due to its compact size and surface-mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,428 parts In-Stock

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6,428

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Digiode

USA . 2,094 parts In-Stock

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2,094

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Distributors (Availability)

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One Stop Electronics

USA . 935 parts In-Stock

1+ parts

$2.500

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-

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935

$2.500

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Ampacity Inc.

Singapore . 949 parts In-Stock

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$4.500

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949

$4.500

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Semicontronic

India . 625 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

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$4.365

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-

625

$4.500

$4.388

$4.365

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AZTECH Wire

Italy . 875 parts In-Stock

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$15.539

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875

$15.539

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Parana Technologies

USA . 714 parts In-Stock

1+ parts

$20.029

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$19.960

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714

$20.029

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$19.960

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DigiPath Technology Company

USA . 1,539 parts In-Stock

1+ parts

$22.055

100+ parts

$20.291

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1,539

$22.055

$20.291

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ChromeModa Solutions

Germany . 5,704 parts In-Stock

1+ parts

$22.505

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$18.454

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5,704

$22.505

$18.454

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IDEA Electronic Components Group

UK . 1,921 parts In-Stock

1+ parts

$22.505

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$21.380

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$20.254

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1,921

$22.505

$21.380

$20.254

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Lixinc

USA . 10,145 parts In-Stock

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10,145

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A-Z Elektronik GmbH

Germany . 7,463 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,975 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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2,700

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Kepictronics

USA . 1,412 parts In-Stock

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1,412

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Native Components

USA . 615 parts In-Stock

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615

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Corphita

USA . 573 parts In-Stock

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573

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Corohmni

South Africa . 357 parts In-Stock

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357

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Northwest PG Solutions

USA . 305 parts In-Stock

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305

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Microchip USA

USA . 264 parts In-Stock

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264

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Overview

Experience unparalleled power management with the BQ77908DBTR by Texas Instruments. As a leader in the industry, Texas Instruments has crafted this Power Management IC with precision and expertise. Ideal for a wide range of applications, this product offers customers reliability, efficiency, and peace of mind. Say goodbye to power supply issues and hello to seamless performance with the BQ77908DBTR. Trust Texas Instruments to deliver top-notch quality and innovation that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IC, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort during the manufacturing process.

Nominal Supply Voltage (Vsup): 6.4 V

A suitable supply voltage that meets the power requirements of the IC, ensuring optimal performance.

No. of Terminals: 38

Sufficient number of terminals for connecting various external components, enabling versatility in circuit design.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial applications where heat dissipation is a concern.

Width (mm): 4.4 mm

Compact size allows for space-efficient placement on PCBs, ideal for applications with limited board real estate.

Minimum Supply Voltage (Vsup): 5.6 V

A low minimum supply voltage ensures compatibility with a wide range of power sources, increasing flexibility in design.

Maximum Supply Current (Isup): 0.075 mA

Low supply current requirement helps minimize power consumption, making the product energy-efficient.

Adjustable Threshold: YES

Ability to adjust the threshold voltage allows for customizing the device to specific application requirements, enhancing versatility.

Technical Specifications

Power Management ICs BQ77908DBTR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G38

Length:

9.7 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

38

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5.6/35

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.075 mA

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

5.6 V

Nominal Supply Voltage (Vsup):

6.4 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

BQ77908DBTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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