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BQ771809DPJR

Texas Instruments

BQ771809DPJR by Texas Instruments

BQ771809DPJR by Texas Instruments is a Power Management IC with a small outline, heat sink package style. It has a nominal threshold voltage of +4.2V and max supply voltage of 25V, making it ideal for power supply support circuits. With surface mount capability and compact dimensions of 3mm x 4mm x 0.8mm, it is suitable for applications requiring low power consumption and space constraints.

Median Price

$0.845

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,530 parts In-Stock

1+ parts

$0.845

100+ parts

$0.650

1k+ parts

$0.342

10k+ parts

-

15,530

$0.845

$0.650

$0.342

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,779 parts In-Stock

1+ parts

$0.803

100+ parts

-

1k+ parts

-

10k+ parts

-

3,779

$0.803

-

-

-

Vyrian

USA . 4,847 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,847

-

-

-

-

Greenchips

USA . 2,287 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,287

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 15,241 parts In-Stock

1+ parts

$0.720

100+ parts

-

1k+ parts

-

10k+ parts

-

15,241

$0.720

-

-

-

Semicontronic

India . 15,103 parts In-Stock

1+ parts

$0.720

100+ parts

$0.702

1k+ parts

$0.698

10k+ parts

-

15,103

$0.720

$0.702

$0.698

-

Corphita

USA . 3,545 parts In-Stock

1+ parts

$0.760

100+ parts

-

1k+ parts

-

10k+ parts

-

3,545

$0.760

-

-

-

Corohmni

South Africa . 139 parts In-Stock

1+ parts

$0.845

100+ parts

-

1k+ parts

-

10k+ parts

-

139

$0.845

-

-

-

Microchip USA

USA . 1,487 parts In-Stock

1+ parts

$3.143

100+ parts

-

1k+ parts

-

10k+ parts

-

1,487

$3.143

-

-

-

AZTECH Wire

Italy . 521 parts In-Stock

1+ parts

$14.090

100+ parts

-

1k+ parts

-

10k+ parts

-

521

$14.090

-

-

-

Parana Technologies

USA . 1,480 parts In-Stock

1+ parts

$17.769

100+ parts

-

1k+ parts

$17.951

10k+ parts

-

1,480

$17.769

-

$17.951

-

DigiPath Technology Company

USA . 1,172 parts In-Stock

1+ parts

$19.566

100+ parts

$18.000

1k+ parts

-

10k+ parts

-

1,172

$19.566

$18.000

-

-

ChromeModa Solutions

Germany . 82 parts In-Stock

1+ parts

$19.965

100+ parts

$16.371

1k+ parts

-

10k+ parts

-

82

$19.965

$16.371

-

-

IDEA Electronic Components Group

UK . 62 parts In-Stock

1+ parts

$19.965

100+ parts

$18.967

1k+ parts

$17.968

10k+ parts

-

62

$19.965

$18.967

$17.968

-

Authorized Procurement Solutions

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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24,000

-

-

-

-

Computer Components Inc. - USA

USA . 12,787 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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12,787

-

-

-

-

Lixinc

USA . 8,105 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,105

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,000

-

-

-

-

Kepictronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

Northwest PG Solutions

USA . 1,588 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,588

-

-

-

-

Native Components

USA . 26 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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26

-

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-

Overview

Enhance your power management solutions with the BQ771809DPJR by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides exceptional performance and efficiency. Experience the value of seamless power supply support circuitry in a compact and durable package. Trust Texas Instruments to deliver innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the BQ771809DPJR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and resistance to heat and moisture, making this product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort in the assembly process.

Package Shape: RECTANGULAR

Rectangular shape provides a compact form factor, making it suitable for applications where space is limited.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Small outline, heat sink/slug, and very thin profile enhance thermal performance and allow for efficient heat dissipation, ensuring stable operation.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish offers high conductivity and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit design and allows for versatile connections in different configurations.

Maximum Seated Height: 0.8 mm

Low seated height minimizes overall package size and allows for compact integration into electronic devices.

Width (mm): 3 mm

Narrow width facilitates space-saving design and allows for dense packing of components on a circuit board.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Power supply support circuit offers efficient power management capabilities, ensuring stable and reliable performance of connected systems.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time of 30 seconds reduces the risk of thermal damage to the IC during soldering, ensuring proper functionality.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for a reliable soldering process without compromising the integrity of the IC.

Length: 4 mm

Compact length enables easy integration into tight spaces and contributes to the overall space-efficient design of the product.

Nominal Threshold Voltage (V): +4.2V

Nominal threshold voltage of +4.2V ensures precise power regulation, making this IC suitable for a wide range of applications.

Maximum Supply Current (Isup): 0.002 mA

Low maximum supply current of 0.002 mA results in power-efficient operation and minimizes energy consumption in the system.

Terminal Form: NO LEAD

No-lead terminal form offers environmental benefits and facilitates RoHS compliance, making this product a sustainable choice.

Terminal Pitch: 0.65 mm

Narrow terminal pitch of 0.65 mm allows for high-density packaging and enhances the overall compactness of the IC.

Maximum Supply Voltage (Vsup): 25 V

High maximum supply voltage of 25V provides versatility in power supply compatibility and makes this IC suitable for various applications.

Technical Specifications

Power Management ICs BQ771809DPJR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

Battery over-voltage protection(Min/Max)(V) : 3.85 and 4.65

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Current (Isup):

.002 mA

Maximum Supply Voltage (Vsup):

25 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.2V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

BQ771809DPJR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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