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BQ771801DPJT

Texas Instruments

BQ771801DPJT by Texas Instruments

BQ771801DPJT by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 3-25V, and temperature range of -40 to 110°C. It is designed for power supply support circuits in industrial applications requiring a compact package style with surface mount capability.

Median Price

$1.404

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,750 parts In-Stock

1+ parts

$1.309

100+ parts

$1.007

1k+ parts

$0.530

10k+ parts

-

2,750

$1.309

$1.007

$0.530

-

DigiKey

USA . 495 parts In-Stock

1+ parts

$1.500

100+ parts

$0.880

1k+ parts

$0.827

10k+ parts

-

495

$1.500

$0.880

$0.827

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 179 parts In-Stock

1+ parts

$1.244

100+ parts

-

1k+ parts

-

10k+ parts

-

179

$1.244

-

-

-

Chip Stock

USA . 124,640 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

124,640

-

-

-

-

Vyrian

USA . 7,644 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,644

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,372 parts In-Stock

1+ parts

$1.110

100+ parts

$1.082

1k+ parts

$1.077

10k+ parts

-

1,372

$1.110

$1.082

$1.077

-

Ampacity Inc.

Singapore . 1,253 parts In-Stock

1+ parts

$1.110

100+ parts

-

1k+ parts

-

10k+ parts

-

1,253

$1.110

-

-

-

Corphita

USA . 4,817 parts In-Stock

1+ parts

$1.178

100+ parts

-

1k+ parts

-

10k+ parts

-

4,817

$1.178

-

-

-

Corohmni

South Africa . 479 parts In-Stock

1+ parts

$1.309

100+ parts

-

1k+ parts

-

10k+ parts

-

479

$1.309

-

-

-

Parana Technologies

USA . 2,219 parts In-Stock

1+ parts

$14.791

100+ parts

-

1k+ parts

$15.222

10k+ parts

-

2,219

$14.791

-

$15.222

-

DigiPath Technology Company

USA . 254 parts In-Stock

1+ parts

$16.287

100+ parts

-

1k+ parts

-

10k+ parts

-

254

$16.287

-

-

-

ChromeModa Solutions

Germany . 6,493 parts In-Stock

1+ parts

$16.619

100+ parts

$13.628

1k+ parts

-

10k+ parts

-

6,493

$16.619

$13.628

-

-

IDEA Electronic Components Group

UK . 136 parts In-Stock

1+ parts

$16.619

100+ parts

$15.788

1k+ parts

$14.957

10k+ parts

-

136

$16.619

$15.788

$14.957

-

Native Components

USA . 44 parts In-Stock

1+ parts

$33.617

100+ parts

-

1k+ parts

-

10k+ parts

$32.272

44

$33.617

-

-

$32.272

Northwest PG Solutions

USA . 570 parts In-Stock

1+ parts

$36.978

100+ parts

-

1k+ parts

-

10k+ parts

-

570

$36.978

-

-

-

Overview

Elevate your power management game with the BQ771801DPJT by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Designed to meet industrial standards, this IC provides efficient power supply support in a compact package. With a wide operating temperature range and minimal supply current, this IC is perfect for a variety of applications. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and unlocks endless possibilities for your projects. Choose the BQ771801DPJT for superior performance and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and prevents damage to the internal components of the IC, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during production.

Power Supplies (V): 3/25

Supports a wide range of power supplies from 3V to 25V, making it versatile and compatible with various applications.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Compact and slim package design with a heat sink feature ensures efficient heat dissipation and space-saving in applications with limited space.

Maximum Operating Temperature: 110 °C

High maximum operating temperature ensures reliable performance even in challenging environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

Wide range of operating temperature from -40°C to 110°C allows for usage in both extreme cold and hot conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish resists corrosion and ensures good electrical conductivity, leading to stable and efficient performance.

Maximum Seated Height: 0.75 mm

Low profile design with a maximum seated height of 0.75mm enables easy integration into compact electronic devices.

Width (mm): 3 mm

Narrow width of 3mm allows for efficient use of space on the circuit board, ideal for applications with size constraints.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed for power supply support, ensuring stable and reliable power management for connected devices.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures secure soldering during assembly, preventing any damage to the IC.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance makes this IC suitable for use in harsh industrial environments with extreme temperature fluctuations.

Maximum Supply Current (Isup): 0.002 mA

Low maximum supply current requirement of 0.002 mA results in energy-efficient operation and minimal power consumption.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures safe handling during manufacturing and disposal.

Terminal Pitch: 0.65 mm

Optimal terminal pitch of 0.65mm allows for easy and precise soldering of the IC onto the circuit board, ensuring stable connections.

Maximum Supply Voltage (Vsup): 25 V

Supports a maximum supply voltage of 25V, making it suitable for a wide range of applications requiring higher voltage levels.

Technical Specifications

Power Management ICs BQ771801DPJT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

Battery over-voltage protection(Min/Max)(V) : 3.85 and 4.65

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.16,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/25

Qualification:

Not Qualified

Maximum Seated Height:

.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.002 mA

Maximum Supply Voltage (Vsup):

25 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.275V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

BQ771801DPJT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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