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BQ4285ESTR

Texas Instruments

BQ4285ESTR by Texas Instruments

BQ4285ESTR by Texas Instruments is a CMOS timer & real-time clock IC with 24 terminals. It operates b/w 0-70°C, with supply voltage range of 4.5-5.5V. Access data via parallel or muxed bus for applications requiring accurate timekeeping in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,397 parts In-Stock

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Digiode

USA . 3,154 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 824 parts In-Stock

1+ parts

$0.032

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$0.031

824

$0.032

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$0.031

AZTECH Wire

Italy . 632 parts In-Stock

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$16.616

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632

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One Stop Electronics

USA . 996 parts In-Stock

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$33.000

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996

$33.000

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Parana Technologies

USA . 852 parts In-Stock

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$48.388

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$4,493.598

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$43.550

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852

$48.388

$4,493.598

$43.550

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DigiPath Technology Company

USA . 1,683 parts In-Stock

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$53.282

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1,683

$53.282

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ChromeModa Solutions

Germany . 4,747 parts In-Stock

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$54.369

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$44.583

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4,747

$54.369

$44.583

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IDEA Electronic Components Group

UK . 1,918 parts In-Stock

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$54.369

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$51.651

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$48.932

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1,918

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$48.932

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Corohmni

South Africa . 975 parts In-Stock

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$65.768

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Northwest PG Solutions

USA . 525 parts In-Stock

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525

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Corphita

USA . 325 parts In-Stock

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Overview

Elevate your projects with the BQ4285ESTR by Texas Instruments, a top-of-the-line Timer & Real-Time Clock designed to deliver precision and reliability. Crafted by the reputable manufacturer Texas Instruments, this product offers unparalleled quality and performance. Perfect for a wide range of applications, this timer boasts a compact design and user-friendly features that guarantee seamless integration. Stay ahead of the curve and experience the value and benefits this exceptional product brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Information Access Method: PARALLEL, MUXED BUS

The parallel and muxed bus access method allows for efficient and fast data transfer, improving overall performance.

Surface Mount: YES

Surface mount capability makes the installation process easier and saves space on the PCB.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage provides flexibility in power source selection and allows for compatibility with a variety of systems.

Package Shape: RECTANGULAR

The rectangular package shape is common and easy to mount, suitable for various electronic applications.

No. of Terminals: 24

Having 24 terminals allows for more connectivity options and versatility in circuit design.

Minimum Supply Voltage: 4.5 V

A lower minimum supply voltage ensures power efficiency and compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures stable performance even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function in cold environments without issues.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB layout and allow for better routing of connections.

Maximum Seated Height: 2.67 mm

The low maximum seated height saves space in the device and allows for slim and compact designs.

Width: 7.56 mm

The compact width makes the product suitable for applications where space is limited.

External Data Bus Width: 8

An external data bus width of 8 allows for efficient data transfer and processing capabilities.

Maximum Clock Frequency: 0.032 MHz

The maximum clock frequency of 0.032 MHz ensures accurate timing and synchronization in various applications.

Length: 15.43 mm

The overall length of the product is compact, making it suitable for applications with limited space available.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates the product is suitable for standard commercial applications with typical temperature ranges.

Peripheral IC Type: TIMER, REAL TIME CLOCK

The product serves as both a timer and real-time clock, providing dual functionalities in a single package.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering during PCB assembly, ensuring secure connections and reliable performance.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a common standard, ensuring compatibility with a wide range of electronic systems.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for precise and secure connections on the PCB, ensuring reliable operation.

Technical Specifications

Timers & Real-Time Clocks BQ4285ESTR attributes and parameters. Explore more Timers & Real-Time Clocks devices from Texas Instruments

Specs

Maximum Clock Frequency:

.032 MHz

External Data Bus Width:

8

Information Access Method:

PARALLEL, MUXED BUS

JESD-30 Code:

R-PDSO-G24

Length:

15.43 mm

No. of Terminals:

24

No. of Timers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.67 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.56 mm

Peripheral IC Type:

Trade Compliance

BQ4285ESTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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