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BQ4285LQN

Texas Instruments

BQ4285LQN by Texas Instruments

BQ4285LQN by Texas Instruments is a CMOS timer & real-time clock IC with 28 terminals. It operates b/w -40 to 85°C, with supply voltage range of 2.7-3.6V. Featuring parallel/muxed bus access, it's ideal for industrial applications requiring interrupt capability and external data bus width of 8 bits at a max clock frequency of 0.032 MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,298 parts In-Stock

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Digiode

USA . 3,787 parts In-Stock

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Native Components

USA . 55 parts In-Stock

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$1.490

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55

$1.490

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Northwest PG Solutions

USA . 87 parts In-Stock

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$1.639

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$1.639

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AZTECH Wire

Italy . 324 parts In-Stock

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$15.420

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One Stop Electronics

USA . 1,131 parts In-Stock

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$17.000

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Corohmni

South Africa . 1,013 parts In-Stock

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$37.642

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Parana Technologies

USA . 2,031 parts In-Stock

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$59.709

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DigiPath Technology Company

USA . 721 parts In-Stock

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$65.747

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ChromeModa Solutions

Germany . 3,874 parts In-Stock

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$67.089

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$55.013

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IDEA Electronic Components Group

UK . 2,135 parts In-Stock

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$67.089

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$63.735

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$60.380

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Corphita

USA . 3,118 parts In-Stock

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Overview

Elevate your electronic devices with the Texas Instruments BQ4285LQN, a top-of-the-line Timer & Real-Time Clock. Crafted with precision and quality in mind, Texas Instruments delivers unmatched reliability and performance. Perfect for a wide range of applications, this versatile chip carrier offers interrupt capability, parallel access method, and a maximum clock frequency of 0.032 MHz. Take your products to the next level with the industrial-grade BQ4285LQN, providing customers with value, efficiency, and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, increasing its longevity.

Information Access Method: PARALLEL, MUXED BUS

Having both parallel and muxed bus access methods provides flexibility in integrating the timer and real-time clock into various systems.

Surface Mount: YES

Being surface mountable makes installation easier and enables the product to be used in compact designs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for compatibility with a wide range of power sources.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy alignment during assembly.

Power Supplies (V): 3.15

The specific power supply voltage ensures stable and reliable operation of the timer and real-time clock.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options for interfacing with other components in the system.

Interrupt Capability: Y

The interrupt capability allows the device to signal events or alarms, enhancing its functionality in time-sensitive applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers improved thermal performance and easier handling during manufacturing.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage ensures that the timer and real-time clock can operate even in scenarios with limited power availability.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable functionality even in extreme cold environments.

Terminal Position: QUAD

The quad terminal positioning allows for easy soldering and connection to the circuit board.

External Data Bus Width: 8

An external data bus width of 8 bits enables efficient data transfer between the timer/real-time clock and other system components.

Maximum Clock Frequency: 0.032 MHz

The maximum clock frequency of 0.032 MHz indicates the speed at which the timer and real-time clock can process time-related functions.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can operate reliably in demanding industrial environments.

Peripheral IC Type: TIMER, REAL TIME CLOCK

Being a combination of a timer and real-time clock, this product offers versatile timekeeping features for various applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption and reliable performance, making the product energy-efficient.

Terminal Form: J BEND

The J bend terminal form allows for easy connection to external circuitry, enhancing the product's usability in different setups.

Minimum Time: SECONDS

The capability to measure time in seconds provides precise timing functionality, crucial for time-sensitive applications.

Nominal Supply Voltage: 3.15 V

The nominal supply voltage of 3.15 V ensures stable and consistent power delivery to the timer and real-time clock.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for easy interfacing with standard connectors and sockets, simplifying the integration process.

Volatile: YES

Being volatile means that the timer and real-time clock require a backup power source to retain timekeeping data, ensuring data integrity in case of power loss.

Technical Specifications

Timers & Real-Time Clocks BQ4285LQN attributes and parameters. Explore more Timers & Real-Time Clocks devices from Texas Instruments

Specs

Maximum Clock Frequency:

.032 MHz

External Data Bus Width:

8

Information Access Method:

PARALLEL, MUXED BUS

Interrupt Capability:

Y

JESD-30 Code:

S-PQCC-J28

No. of Terminals:

28

No. of Timers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.15

Qualification:

Not Qualified

Sub-Category:

Timer or RTC

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Minimum Time:

SECONDS

Volatile:

YES

Peripheral IC Type:

Trade Compliance

BQ4285LQN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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