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BQ34Z653DBTR

Texas Instruments

BQ34Z653DBTR by Texas Instruments

BQ34Z653DBTR by Texas Instruments is a Power Management IC with 44 terminals, operating b/w -40 to 85°C. It supports supply voltages from 4.5V to 25V and has an adjustable threshold feature. Ideal for industrial applications requiring power supply support circuits in compact spaces.

Median Price

$4.146

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 8,000 parts In-Stock

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-

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$4.146

8,000

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$4.146

Vyrian

USA . 7,289 parts In-Stock

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7,289

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Digiode

USA . 4,726 parts In-Stock

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4,726

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Chip Stock

USA . 137 parts In-Stock

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137

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Distributors (Availability)

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One Stop Electronics

USA . 711 parts In-Stock

1+ parts

$3.500

100+ parts

-

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711

$3.500

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Semicontronic

India . 947 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

10k+ parts

-

947

$4.500

$4.388

$4.365

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Ampacity Inc.

Singapore . 1,352 parts In-Stock

1+ parts

$5.500

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1,352

$5.500

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Native Components

USA . 59 parts In-Stock

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$9.430

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59

$9.430

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Parana Technologies

USA . 260 parts In-Stock

1+ parts

$10.170

100+ parts

-

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$10.710

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260

$10.170

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$10.710

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Northwest PG Solutions

USA . 1,611 parts In-Stock

1+ parts

$10.373

100+ parts

$9.336

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1,611

$10.373

$9.336

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IDEA Electronic Components Group

UK . 557 parts In-Stock

1+ parts

$11.427

100+ parts

$10.856

1k+ parts

$10.284

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557

$11.427

$10.856

$10.284

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ChromeModa Solutions

Germany . 263 parts In-Stock

1+ parts

$11.427

100+ parts

$9.370

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263

$11.427

$9.370

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AZTECH Wire

Italy . 890 parts In-Stock

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$16.493

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890

$16.493

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QUARKTWIN TECHNOLOGY LTD

USA . 9,025 parts In-Stock

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Corphita

USA . 3,382 parts In-Stock

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DigiPath Technology Company

USA . 1,618 parts In-Stock

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$10.303

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1,618

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$10.303

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Corohmni

South Africa . 486 parts In-Stock

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486

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Microchip USA

USA . 253 parts In-Stock

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253

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Overview

Elevate your power management solutions with the BQ34Z653DBTR by Texas Instruments. Expertly crafted with precision and reliability in mind, this Power Management IC offers unparalleled performance for a wide range of applications. From industrial settings to consumer electronics, this small outline, thin profile device provides unmatched value and benefits. With adjustable thresholds and dual terminal positions, it's the perfect choice for your next project. Trust Texas Instruments to deliver quality products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and ensures reliable performance of the Power Management IC.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 14 V

Suitable for applications requiring a stable and consistent supply voltage of 14 V.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this Power Management IC can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in low temperatures as low as -40°C, making it suitable for a wide range of operating environments.

Width (mm): 4.4 mm

Compact width of 4.4 mm allows for a space-efficient design when integrating this Power Management IC into a system.

Technical Specifications

Power Management ICs BQ34Z653DBTR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e4

Length:

11.15 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP44,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

14

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

25 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

14 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

BQ34Z653DBTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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