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BQ3285LFSS-A1TRG4

Texas Instruments

BQ3285LFSS-A1TRG4 by Texas Instruments

BQ3285LFSS-A1TRG4 by Texas Instruments is a CMOS TIMER & REAL TIME CLOCK with 24 terminals, operating at 3/5V. It features PARALLEL, MUXED BUS access method and interrupts capability. Ideal for applications requiring precise timekeeping in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,324 parts In-Stock

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Digiode

USA . 3,465 parts In-Stock

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3,465

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Distributors (Availability)

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AZTECH Wire

Italy . 421 parts In-Stock

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$18.277

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$18.277

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One Stop Electronics

USA . 601 parts In-Stock

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$31.000

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601

$31.000

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Parana Technologies

USA . 721 parts In-Stock

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$31.844

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$90.420

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$31.844

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DigiPath Technology Company

USA . 2,067 parts In-Stock

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$35.064

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ChromeModa Solutions

Germany . 5,277 parts In-Stock

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$35.780

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$29.340

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$35.780

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IDEA Electronic Components Group

UK . 1,822 parts In-Stock

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$35.780

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$33.991

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$32.202

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$32.202

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Corohmni

South Africa . 325 parts In-Stock

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$40.864

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325

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$60.361

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$54.929

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$49.496

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Component Stockers USA

USA . 564 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 6,008 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,005 parts In-Stock

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Corphita

USA . 2,875 parts In-Stock

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Kepictronics

USA . 2,070 parts In-Stock

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Northwest PG Solutions

USA . 1,082 parts In-Stock

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Native Components

USA . 923 parts In-Stock

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Microchip USA

USA . 465 parts In-Stock

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Overview

Discover the innovative BQ3285LFSS-A1TRG4 by Texas Instruments, a high-quality timer and real-time clock designed to enhance your electronic projects. With Texas Instruments' reputation for excellence in semiconductor manufacturing, you can trust in the reliability and precision of this product. Ideal for applications requiring accurate timekeeping, scheduling, and data logging, this versatile component offers value and efficiency to customers looking to streamline their designs. Upgrade your projects with the BQ3285LFSS-A1TRG4 and experience the difference TI technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable devices.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of power sources and environments.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures makes this product suitable for a variety of applications, including industrial and automotive.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this product efficient and reliable.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this product can withstand the soldering process during assembly without damage.

Technical Specifications

Timers & Real-Time Clocks BQ3285LFSS-A1TRG4 attributes and parameters. Explore more Timers & Real-Time Clocks devices from Texas Instruments

Specs

Maximum Clock Frequency:

.032 MHz

External Data Bus Width:

8

Information Access Method:

PARALLEL, MUXED BUS

Interrupt Capability:

Y

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

24

No. of Timers:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.73 mm

Sub-Category:

Timer or RTC

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Minimum Time:

SECONDS

Maximum Time At Peak Reflow Temperature (s):

30

Volatile:

NO

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

BQ3285LFSS-A1TRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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