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BQ3285ESSG4

Texas Instruments

BQ3285ESSG4 by Texas Instruments

BQ3285ESSG4 by Texas Instruments is a CMOS TIMER & REAL TIME CLOCK with 24 terminals, operating at 0-70°C. It has an external data bus width of 8 bits and supports interrupt capability. This IC is suitable for applications requiring precise timekeeping in commercial-grade devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,652 parts In-Stock

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5,652

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Digiode

USA . 4,357 parts In-Stock

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4,357

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Distributors (Availability)

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AZTECH Wire

Italy . 713 parts In-Stock

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$15.241

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713

$15.241

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One Stop Electronics

USA . 963 parts In-Stock

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$20.000

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963

$20.000

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Corohmni

South Africa . 97 parts In-Stock

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$42.267

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97

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Parana Technologies

USA . 1,012 parts In-Stock

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$58.696

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$58.696

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DigiPath Technology Company

USA . 836 parts In-Stock

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$64.631

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$59.461

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836

$64.631

$59.461

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ChromeModa Solutions

Germany . 3,230 parts In-Stock

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$65.950

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$54.079

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$65.950

$54.079

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IDEA Electronic Components Group

UK . 5 parts In-Stock

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$65.950

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$62.652

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$59.355

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5

$65.950

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$59.355

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Corphita

USA . 2,392 parts In-Stock

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Northwest PG Solutions

USA . 2,263 parts In-Stock

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Native Components

USA . 383 parts In-Stock

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Overview

Enhance your product designs with the BQ3285ESSG4 by Texas Instruments, a high-quality timer and real-time clock that offers unmatched precision and reliability. Manufactured by industry leader Texas Instruments, this versatile component is perfect for a wide range of applications. With its compact design and advanced features, the BQ3285ESSG4 provides exceptional value and benefits to customers looking for top-notch performance in their electronic devices. Upgrade your projects with this innovative solution and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the timer and real-time clock, making it suitable for various environmental conditions.

Information Access Method: PARALLEL, MUXED BUS

The parallel and multiplexed bus access methods allow for efficient communication and data transfer, enhancing the overall performance of the timer and real-time clock.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this product can function reliably in a wide range of temperature environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures that the timer and real-time clock can start functioning effectively even in colder conditions.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5 V allows for flexibility in power input options, making it compatible with a variety of power sources.

Minimum Supply Voltage: 4.5 V

Having a minimum supply voltage of 4.5 V ensures that the timer and real-time clock can still operate efficiently with lower power input, conserving energy.

Peripheral IC Type: TIMER, REAL TIME CLOCK

The combination of timer and real-time clock functionalities in one peripheral IC enhances the versatility and utility of the product for time-tracking and control applications.

Terminal Form: GULL WING

The gull wing terminal form provides a secure and reliable connection for the product, ensuring stable communication and power supply for uninterrupted operation.

Technical Specifications

Timers & Real-Time Clocks BQ3285ESSG4 attributes and parameters. Explore more Timers & Real-Time Clocks devices from Texas Instruments

Specs

Maximum Clock Frequency:

.032 MHz

External Data Bus Width:

8

Information Access Method:

PARALLEL, MUXED BUS

Interrupt Capability:

Y

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

24

No. of Timers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Timer or RTC

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Minimum Time:

SECONDS

Maximum Time At Peak Reflow Temperature (s):

30

Volatile:

YES

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

BQ3285ESSG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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