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BQ3285ECSSTR

Texas Instruments

BQ3285ECSSTR by Texas Instruments

BQ3285ECSSTR by Texas Instruments is a CMOS TIMER & REAL TIME CLOCK with 24 terminals. It operates b/w 0-70°C, with supply voltage range of 4.5-5.5V and clock frequency up to 0.032 MHz. Ideal for applications requiring parallel/muxed bus access in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,808 parts In-Stock

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Digiode

USA . 1,593 parts In-Stock

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AZTECH Wire

Italy . 316 parts In-Stock

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$6.281

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316

$6.281

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Parana Technologies

USA . 1,748 parts In-Stock

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$15.455

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$15.836

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DigiPath Technology Company

USA . 1,106 parts In-Stock

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$17.018

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$17.018

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ChromeModa Solutions

Germany . 5,637 parts In-Stock

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$17.365

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$14.239

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IDEA Electronic Components Group

UK . 523 parts In-Stock

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$17.365

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$16.497

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$15.628

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523

$17.365

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$15.628

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One Stop Electronics

USA . 1,294 parts In-Stock

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$29.000

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$29.000

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Corohmni

South Africa . 1,195 parts In-Stock

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$42.316

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Corphita

USA . 1,289 parts In-Stock

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Native Components

USA . 743 parts In-Stock

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Northwest PG Solutions

USA . 220 parts In-Stock

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Overview

Looking to enhance your electronic devices with precise timekeeping and scheduling capabilities? Look no further than the BQ3285ECSSTR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. This real-time clock is perfect for a wide range of applications, offering seamless integration and superior performance. Say goodbye to manual time adjustments and hello to convenience and accuracy with the BQ3285ECSSTR. Join countless satisfied customers who have experienced the value and benefits that this innovative product brings to their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Information Access Method: PARALLEL, MUXED BUS

The parallel and muxed bus access methods provide efficient communication between the device and external components, allowing for quick data transfer.

Surface Mount: YES

The surface-mount capability allows for easy and secure installation on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, making the product versatile and reliable.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration into electronic devices and provides a standardized form factor for compatibility.

No. of Terminals: 24

Having 24 terminals allows for versatile connectivity options and enables the device to interface with multiple external components.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style maximizes space efficiency on the PCB, ideal for compact electronic designs.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures the device can operate even with lower power sources, enhancing flexibility in various use cases.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance allows the product to function reliably in challenging environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can operate in cold environments without performance issues.

Terminal Position: DUAL

Having dual terminal positions provides redundancy and flexibility in connectivity, reducing the risk of connection failures.

Maximum Seated Height: 1.73 mm

The low maximum seated height allows for low profile designs and enables the product to be integrated into thinner electronic devices.

Width: 3.9 mm

The compact width of the product enables space-saving integration into electronic circuits, especially in applications with limited board space.

External Data Bus Width: 8

The 8-bit external data bus width enhances data processing capabilities and supports efficient communication with external components.

Maximum Clock Frequency: 0.032 MHz

The maximum clock frequency of 0.032 MHz allows for precise timing operations and ensures reliable performance in time-sensitive applications.

Length: 8.65 mm

The length of 8.65 mm provides a compact form factor and enables easy integration into electronic devices with limited space.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation in typical indoor environments, making it suitable for a wide range of commercial applications.

Peripheral IC Type: TIMER, REAL TIME CLOCK

The combination of timer and real-time clock functionalities adds versatility to the product, making it suitable for various timing and scheduling tasks.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and excellent reliability, making the product energy-efficient and durable.

Terminal Form: GULL WING

The gull wing terminal form enhances soldering reliability and mechanical strength, ensuring secure connections for long-term stability.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V ensures compatibility with standard power sources, making the product easy to integrate into existing electronic systems.

Terminal Pitch: 0.635 mm

The small terminal pitch allows for precise and reliable connections, reducing the risk of signal interference and ensuring optimal performance.

Technical Specifications

Timers & Real-Time Clocks BQ3285ECSSTR attributes and parameters. Explore more Timers & Real-Time Clocks devices from Texas Instruments

Specs

Maximum Clock Frequency:

.032 MHz

External Data Bus Width:

8

Information Access Method:

PARALLEL, MUXED BUS

JESD-30 Code:

R-PDSO-G24

Length:

8.65 mm

No. of Terminals:

24

No. of Timers:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.73 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

BQ3285ECSSTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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