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BQ3285ESSTRG4

Texas Instruments

BQ3285ESSTRG4 by Texas Instruments

BQ3285ESSTRG4 by Texas Instruments is a CMOS TIMER & REAL TIME CLOCK with 24 terminals, operating at 0-70°C. It has an external data bus width of 8 bits and can handle a clock frequency of 0.032 MHz. Ideal for applications requiring precise timekeeping in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,545 parts In-Stock

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Digiode

USA . 638 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 539 parts In-Stock

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$12.365

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539

$12.365

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One Stop Electronics

USA . 503 parts In-Stock

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$22.000

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Parana Technologies

USA . 2,094 parts In-Stock

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$29.806

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$63.449

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DigiPath Technology Company

USA . 83 parts In-Stock

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$32.820

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ChromeModa Solutions

Germany . 3,601 parts In-Stock

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$33.490

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$27.462

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IDEA Electronic Components Group

UK . 952 parts In-Stock

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$33.490

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$31.816

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$30.141

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952

$33.490

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Advanced Electronics

New Zealand . 900 parts In-Stock

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$42.177

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$38.381

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$34.585

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Corohmni

South Africa . 74 parts In-Stock

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$51.270

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Microchip USA

USA . 3,930 parts In-Stock

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Northwest PG Solutions

USA . 716 parts In-Stock

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Corphita

USA . 631 parts In-Stock

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Native Components

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Overview

Unlock the potential of precise timekeeping with the BQ3285ESSTRG4 by Texas Instruments. Crafted with superior quality and reliability, this real-time clock offers unmatched accuracy for a wide range of applications. Designed with cutting-edge technology, this product ensures seamless operation and maximum performance. Trust in Texas Instruments' reputation for excellence and elevate your projects with the BQ3285ESSTRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable and cost-effective plastic/epoxy material ensures the product has a sturdy construction while keeping the overall cost low.

Information Access Method: PARALLEL, MUXED BUS

Allows for both parallel and multiplexed bus access, providing flexibility in data transmission and allowing for efficient data communication with other components.

Surface Mount: YES

Suitable for automated assembly processes and offers space-saving benefits, making it ideal for compact electronic devices.

Maximum Supply Voltage: 5.5 V

Can operate at relatively high voltage levels, providing stability and reliability in various usage scenarios.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into existing circuit layouts and makes it compatible with standard packaging methods.

Interrupt Capability: Y

The interrupt capability allows the device to respond to external events promptly, enhancing its real-time clock functionality and overall efficiency.

Technology: CMOS

Complementary metal-oxide-semiconductor technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Timers & Real-Time Clocks BQ3285ESSTRG4 attributes and parameters. Explore more Timers & Real-Time Clocks devices from Texas Instruments

Specs

Maximum Clock Frequency:

.032 MHz

External Data Bus Width:

8

Information Access Method:

PARALLEL, MUXED BUS

Interrupt Capability:

Y

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

24

No. of Timers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Timer or RTC

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Minimum Time:

SECONDS

Maximum Time At Peak Reflow Temperature (s):

30

Volatile:

NO

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

BQ3285ESSTRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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