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BQ29312PWG4

Texas Instruments

BQ29312PWG4 by Texas Instruments

BQ29312PWG4 by Texas Instruments is a Power Management IC with 24 terminals, operating b/w -25 to 85°C. It has a supply voltage range of 4.5-25V and adjustable threshold feature. Ideal for power supply management circuits in various applications due to its small outline package and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,514 parts In-Stock

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Vyrian

USA . 2,483 parts In-Stock

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2,483

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,559 parts In-Stock

1+ parts

$1.500

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1,559

$1.500

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Semicontronic

India . 1,128 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

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1,128

$5.500

$5.362

$5.335

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One Stop Electronics

USA . 284 parts In-Stock

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$5.500

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284

$5.500

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AZTECH Wire

Italy . 724 parts In-Stock

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$10.623

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724

$10.623

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Parana Technologies

USA . 1,321 parts In-Stock

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$19.199

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$19.242

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1,321

$19.199

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$19.242

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DigiPath Technology Company

USA . 1,987 parts In-Stock

1+ parts

$21.141

100+ parts

$19.449

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1,987

$21.141

$19.449

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ChromeModa Solutions

Germany . 3,615 parts In-Stock

1+ parts

$21.572

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$17.689

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3,615

$21.572

$17.689

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IDEA Electronic Components Group

UK . 1,761 parts In-Stock

1+ parts

$21.572

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$20.493

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$19.415

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1,761

$21.572

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$19.415

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Native Components

USA . 664 parts In-Stock

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$27.847

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664

$27.847

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Northwest PG Solutions

USA . 565 parts In-Stock

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$30.631

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$27.568

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565

$30.631

$27.568

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Corphita

USA . 4,356 parts In-Stock

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Microchip USA

USA . 499 parts In-Stock

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499

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Corohmni

South Africa . 103 parts In-Stock

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103

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Overview

Unlock the power of efficient power management with the BQ29312PWG4 by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability for a wide range of applications. From maximizing battery life to ensuring safe and optimized power distribution, this product is designed to deliver value and benefits that exceed expectations. Trust in Texas Instruments to provide you with cutting-edge technology that enhances performance and efficiency in all your electronic devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and cost-effective, making this Power Management IC easy to handle and affordable.

Surface Mount: YES

Surface mount technology allows for efficient and reliable installation on circuit boards.

Nominal Supply Voltage (Vsup): 14 V

Optimal voltage supply for the Power Management IC to operate efficiently.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures stability and performance even in demanding conditions.

Width (mm): 4.4 mm

Compact width saves space on the circuit board, ideal for applications with limited real estate.

Adjustable Threshold: YES

Allows for customization and fine-tuning of the IC's performance according to specific requirements.

Technical Specifications

Power Management ICs BQ29312PWG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/25

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.1 mA

Maximum Supply Voltage (Vsup):

25 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

14 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

BQ29312PWG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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