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BQ29311PWRG4

Texas Instruments

BQ29311PWRG4 by Texas Instruments

BQ29311PWRG4 by Texas Instruments is a Power Management IC with 24 terminals, operating temperature range of -25 to 85°C, and supply voltage up to 34V. It is used in power supply support circuits for commercial applications requiring small outline packages and dual terminal positions.

Median Price

$3.760

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 306 parts In-Stock

1+ parts

-

100+ parts

$3.760

1k+ parts

-

10k+ parts

-

306

-

$3.760

-

-

Rochester

USA . 266 parts In-Stock

1+ parts

-

100+ parts

$3.310

1k+ parts

$2.960

10k+ parts

$2.780

266

-

$3.310

$2.960

$2.780

Verical

USA . 266 parts In-Stock

1+ parts

-

100+ parts

$4.138

1k+ parts

$3.700

10k+ parts

$3.475

266

-

$4.138

$3.700

$3.475

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,028 parts In-Stock

1+ parts

$3.439

100+ parts

-

1k+ parts

-

10k+ parts

-

2,028

$3.439

-

-

-

Vyrian

USA . 5,272 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,272

-

-

-

-

DigiKey Marketplace

USA . 306 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

306

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,625 parts In-Stock

1+ parts

$3.258

100+ parts

-

1k+ parts

-

10k+ parts

-

1,625

$3.258

-

-

-

Parana Technologies

USA . 1,498 parts In-Stock

1+ parts

$3.366

100+ parts

-

1k+ parts

$3.892

10k+ parts

-

1,498

$3.366

-

$3.892

-

DigiPath Technology Company

USA . 2,118 parts In-Stock

1+ parts

$3.706

100+ parts

-

1k+ parts

-

10k+ parts

-

2,118

$3.706

-

-

-

ChromeModa Solutions

Germany . 5,464 parts In-Stock

1+ parts

$3.782

100+ parts

$3.101

1k+ parts

-

10k+ parts

-

5,464

$3.782

$3.101

-

-

IDEA Electronic Components Group

UK . 2,150 parts In-Stock

1+ parts

$3.782

100+ parts

-

1k+ parts

$3.404

10k+ parts

-

2,150

$3.782

-

$3.404

-

Kepictronics

USA . 9,200 parts In-Stock

1+ parts

-

100+ parts

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9,200

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-

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A-Z Elektronik GmbH

Germany . 7,191 parts In-Stock

1+ parts

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7,191

-

-

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Alle Elektronik GmbH

Germany . 4,794 parts In-Stock

1+ parts

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1k+ parts

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4,794

-

-

-

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Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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3,790

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-

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Microchip USA

USA . 2,924 parts In-Stock

1+ parts

-

100+ parts

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2,924

-

-

-

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Northwest PG Solutions

USA . 2,332 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.310

10k+ parts

-

2,332

-

-

$4.310

-

Native Components

USA . 968 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.266

10k+ parts

-

968

-

-

$4.266

-

Overview

Enhance your power management capabilities with the BQ29311PWRG4 by Texas Instruments. With a reputation for top-quality products, Texas Instruments delivers reliable solutions for a variety of applications in the Power Management ICs category. This small outline, thin profile package boasts dual terminal position and nickel palladium gold finish, ensuring optimal performance in commercial extended temperature environments. Experience the value and benefits of 5 channels of power supply support circuitry, all in a compact and reliable design. Elevate your power management solutions with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for a compact design and easy integration onto circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 14 V

The nominal supply voltage of 14 V is suitable for a wide range of applications, providing flexibility and compatibility with various power sources.

No. of Terminals: 24

Having 24 terminals allows for multiple connections and functions, increasing the versatility and functionality of the power management IC.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even under harsh environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, maintaining signal integrity and prolonging the life of the terminals.

Width (mm): 4.4 mm

The compact width of 4.4 mm allows for easy integration into tight spaces and crowded PCB layouts, making it ideal for compact electronic devices.

No. of Channels: 5

With 5 channels, this power management IC can handle multiple power sources or loads simultaneously, providing efficient power distribution and management.

Technical Specifications

Power Management ICs BQ29311PWRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

5

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

34 V

Nominal Supply Voltage (Vsup):

14 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

BQ29311PWRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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