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BQ28550DRZT-R1

Texas Instruments

BQ28550DRZT-R1 by Texas Instruments

BQ28550DRZT-R1 by Texas Instruments is a Power Management IC with 12 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 2.45V to 5.5V and features an adjustable threshold for power supply support circuits. This rectangular package IC is suitable for industrial applications requiring precise power management in compact spaces.

Median Price

$3.888

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS (Exports)

UK . 30 parts In-Stock

1+ parts

-

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$3.888

1k+ parts

$3.312

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30

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$3.888

$3.312

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Distributors (In-Stock)

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Vyrian

USA . 7,621 parts In-Stock

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Digiode

USA . 4,906 parts In-Stock

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4,906

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One Stop Electronics

USA . 1,446 parts In-Stock

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$0.500

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$0.500

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Semicontronic

India . 1,601 parts In-Stock

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$2.500

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$2.438

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$2.425

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$2.500

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$2.425

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Ampacity Inc.

Singapore . 1,020 parts In-Stock

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$2.500

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$2.500

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Corohmni

South Africa . 707 parts In-Stock

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$10.075

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707

$10.075

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AZTECH Wire

Italy . 366 parts In-Stock

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$17.650

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$17.650

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Parana Technologies

USA . 1,011 parts In-Stock

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$19.619

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$19.614

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$19.619

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$19.614

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DigiPath Technology Company

USA . 673 parts In-Stock

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$21.603

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$19.875

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673

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$19.875

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ChromeModa Solutions

Germany . 4,456 parts In-Stock

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$22.044

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$18.076

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IDEA Electronic Components Group

UK . 1,795 parts In-Stock

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$22.044

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$20.942

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$19.840

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$20.942

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$26.164

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$23.809

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$21.454

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$26.164

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Lixinc

USA . 14,107 parts In-Stock

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Northwest PG Solutions

USA . 1,932 parts In-Stock

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Corphita

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Native Components

USA . 367 parts In-Stock

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Perfect Parts

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Microchip USA

USA . 106 parts In-Stock

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Overview

Unleash the power of reliable and efficient power management with the BQ28550DRZT-R1 by Texas Instruments. Crafted with precision and expertise, Texas Instruments offers a top-notch solution for various applications in the Power Management ICs category. With a focus on quality and innovation, this product ensures optimal performance and durability. Elevate your projects with the value, benefits, and advantages that this small outline, heat sink package delivers. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations and propels your work to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, reducing production time and cost.

Nominal Supply Voltage (Vsup): 3.6 V

Provides a stable and efficient power supply for various devices.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Allows for compact and space-saving designs, ideal for portable or space-constrained applications.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent conductivity and corrosion resistance, enhancing the product's reliability and longevity.

Width (mm): 2.5 mm

Compact width allows for efficient use of PCB real estate, enabling more components to be packed into a smaller space.

Minimum Supply Voltage (Vsup): 2.45 V

Provides a wide operating voltage range, ensuring compatibility with a variety of power sources.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow soldering processes, making it suitable for automated assembly.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliability even in demanding conditions.

Maximum Supply Voltage (Vsup): 5.5 V

Allows for a wide input voltage range, making the product versatile and suitable for different power sources.

Adjustable Threshold: YES

Provides flexibility in setting voltage thresholds for various applications, enhancing usability and adaptability.

Technical Specifications

Power Management ICs BQ28550DRZT-R1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

OVERCHARGE DETECTION IS 4.25V

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-N12

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.45 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2.5 mm

Trade Compliance

BQ28550DRZT-R1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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