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BQ24747RHDR

Texas Instruments

BQ24747RHDR by Texas Instruments

BQ24747RHDR by Texas Instruments is a voltage-mode battery charge controller with a 7-24V power supply range. It operates in automotive-grade temperatures (-40 to 125°C) and features a max switching frequency of 360 kHz. This chip carrier package with very thin profile is ideal for applications requiring precise control and efficient power management.

Median Price

$26.920

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 65 parts In-Stock

1+ parts

$26.920

100+ parts

$20.190

1k+ parts

$17.500

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65

$26.920

$20.190

$17.500

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Chip Stock

USA . 6,830 parts In-Stock

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Vyrian

USA . 4,689 parts In-Stock

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4,689

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Bristol Electronics

USA . 3,234 parts In-Stock

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Digiode

USA . 1,336 parts In-Stock

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1,336

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Distributors (Availability)

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One Stop Electronics

USA . 1,215 parts In-Stock

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$6.500

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$6.500

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Parana Technologies

USA . 1,903 parts In-Stock

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$14.297

100+ parts

$1,327.690

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$12.867

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1,903

$14.297

$1,327.690

$12.867

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DigiPath Technology Company

USA . 117 parts In-Stock

1+ parts

$15.743

100+ parts

$14.483

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117

$15.743

$14.483

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ChromeModa Solutions

Germany . 3,331 parts In-Stock

1+ parts

$16.064

100+ parts

$13.172

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3,331

$16.064

$13.172

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IDEA Electronic Components Group

UK . 1,462 parts In-Stock

1+ parts

$16.064

100+ parts

$15.261

1k+ parts

$14.458

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$16.064

$15.261

$14.458

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AZTECH Wire

Italy . 521 parts In-Stock

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$18.458

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521

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S.R.D Solutions

India . 15,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,284 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,856 parts In-Stock

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Corphita

USA . 4,181 parts In-Stock

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Kepictronics

USA . 1,637 parts In-Stock

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Microchip USA

USA . 347 parts In-Stock

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347

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Northwest PG Solutions

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Native Components

USA . 120 parts In-Stock

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120

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Overview

Enhance your power management systems with the BQ24747RHDR by Texas Instruments, a top-tier manufacturer known for delivering high-quality switching regulators & controllers. This innovative product offers unmatched performance and reliability, making it ideal for various applications. With a wide input voltage range of 7-24V and a control mode of voltage-mode, this chip carrier package ensures efficient power supplies while maintaining a very thin profile. Experience the benefits of pulse width modulation control technique and push-pull switcher configuration, providing customers with optimal power solutions. Upgrade your power management systems today with the BQ24747RHDR and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and resources.

Control Mode: VOLTAGE-MODE

Provides precise voltage regulation for consistent and stable power output.

Temperature Grade: AUTOMOTIVE

Designed to operate reliably in automotive environments, ensuring durability and performance under varying temperature conditions.

Maximum Switching Frequency: 360 kHz

High switching frequency allows for efficient power conversion, minimizing power loss and heat generation.

Technical Specifications

Switching Regulators & Controllers BQ24747RHDR attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

24 V

Minimum Input Voltage:

7 V

Nominal Input Voltage:

20 V

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

7/24

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

360 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

BQ24747RHDR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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