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BQ24747RHDT

Texas Instruments

BQ24747RHDT by Texas Instruments

BQ24747RHDT by Texas Instruments is a voltage-mode battery charge controller with a switching frequency of 360 kHz. It operates b/w -40 to 125°C, suitable for automotive applications. With a nominal input voltage of 20V and output voltage of 3.3V, it features pulse width modulation control in a compact chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 6,780 parts In-Stock

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6,780

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Vyrian

USA . 6,664 parts In-Stock

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6,664

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Bristol Electronics

USA . 302 parts In-Stock

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302

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Digiode

USA . 110 parts In-Stock

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110

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One Stop Electronics

USA . 1,529 parts In-Stock

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$2.500

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1,529

$2.500

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Semicontronic

India . 1,512 parts In-Stock

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$2.500

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$2.438

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$2.425

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1,512

$2.500

$2.438

$2.425

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Ampacity Inc.

Singapore . 567 parts In-Stock

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$5.500

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567

$5.500

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AZTECH Wire

Italy . 621 parts In-Stock

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$5.865

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621

$5.865

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Parana Technologies

USA . 2,054 parts In-Stock

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$14.439

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$14.879

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2,054

$14.439

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$14.879

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DigiPath Technology Company

USA . 2,027 parts In-Stock

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$15.900

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$14.628

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2,027

$15.900

$14.628

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ChromeModa Solutions

Germany . 3,879 parts In-Stock

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$16.224

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$13.304

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3,879

$16.224

$13.304

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IDEA Electronic Components Group

UK . 1,427 parts In-Stock

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$16.224

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$15.413

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$14.602

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1,427

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$14.602

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Native Components

USA . 633 parts In-Stock

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$151.687

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$145.619

633

$151.687

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$145.619

Northwest PG Solutions

USA . 1,730 parts In-Stock

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$166.855

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Corphita

USA . 4,527 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corohmni

South Africa . 456 parts In-Stock

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456

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Kepictronics

USA . 191 parts In-Stock

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191

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A-Z Elektronik GmbH

Germany . 165 parts In-Stock

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165

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Overview

Elevate your power management solutions with the cutting-edge BQ24747RHDT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unmatched quality and reliability in their products. This switching regulator and controller is perfect for a wide range of applications, providing efficient power supplies ranging from 7V to 24V. With a compact design and advanced features like voltage-mode control and pulse width modulation, this chip carrier offers automotive-grade performance at an unbeatable value. Take your power management to the next level with the BQ24747RHDT and experience the benefits of top-tier technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable makes installation easier and saves space on the circuit board.

Control Mode: VOLTAGE-MODE

Voltage-mode control provides precise regulation of output voltage, making the product efficient and reliable.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures reliable operation in harsh environmental conditions, ideal for automotive applications.

Maximum Switching Frequency: 360 kHz

Higher switching frequency allows for faster response time and better efficiency in power conversion.

Technical Specifications

Switching Regulators & Controllers BQ24747RHDT attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

24 V

Minimum Input Voltage:

7 V

Nominal Input Voltage:

20 V

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

7/24

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

360 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

BQ24747RHDT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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