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BQ24271RGER

Texas Instruments

BQ24271RGER by Texas Instruments

BQ24271RGER by Texas Instruments is a Power Management IC with 24 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial applications. Features include Buck switcher config, 4.2V min supply voltage, and 18V max supply voltage for power supply management circuits.

Median Price

$6.889

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 16,250 parts In-Stock

1+ parts

$6.889

100+ parts

$5.616

1k+ parts

$3.744

10k+ parts

-

16,250

$6.889

$5.616

$3.744

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,911 parts In-Stock

1+ parts

$6.545

100+ parts

-

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2,911

$6.545

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Vyrian

USA . 2,166 parts In-Stock

1+ parts

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2,166

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ABC Electronics Ltd.

UK . 786 parts In-Stock

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786

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,792 parts In-Stock

1+ parts

$6.200

100+ parts

-

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2,792

$6.200

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Parana Technologies

USA . 291 parts In-Stock

1+ parts

$7.874

100+ parts

-

1k+ parts

$8.427

10k+ parts

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291

$7.874

-

$8.427

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DigiPath Technology Company

USA . 1,165 parts In-Stock

1+ parts

$8.670

100+ parts

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1,165

$8.670

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ChromeModa Solutions

Germany . 6,886 parts In-Stock

1+ parts

$8.847

100+ parts

$7.255

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6,886

$8.847

$7.255

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IDEA Electronic Components Group

UK . 1,512 parts In-Stock

1+ parts

$8.847

100+ parts

$8.405

1k+ parts

$7.962

10k+ parts

-

1,512

$8.847

$8.405

$7.962

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AZTECH Wire

Italy . 711 parts In-Stock

1+ parts

$9.740

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711

$9.740

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Northwest PG Solutions

USA . 574 parts In-Stock

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574

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Native Components

USA . 380 parts In-Stock

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380

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Overview

Discover the unparalleled quality and reliability of the Texas Instruments BQ24271RGER Power Management IC. Made from premium materials and designed with precision, this product is perfect for a wide range of applications in various industries. With advanced features and superior performance, this IC offers customers exceptional value, efficiency, and reliability. Trust Texas Instruments to provide innovative solutions that exceed expectations. Elevate your projects with the BQ24271RGER and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to physical damage, ensuring reliability in various operating conditions.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, saving time and effort during production.

No. of Terminals: 24

With 24 terminals, this power management IC provides multiple connectivity options, making it versatile for different circuit configurations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures stable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the IC to function reliably in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides excellent conductivity and corrosion resistance, maintaining signal integrity over time.

Width (mm): 4 mm

The compact width of 4mm makes the IC suitable for space-constrained designs, ideal for applications where size is a critical factor.

Minimum Supply Voltage (Vsup): 4.2 V

The low minimum supply voltage of 4.2V allows the IC to operate efficiently even with limited power sources, increasing its versatility.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, the IC is less susceptible to moisture-induced damage, ensuring long-term reliability in humid environments.

Maximum Supply Voltage (Vsup): 18 V

The high maximum supply voltage of 18V allows the IC to handle higher power requirements, making it suitable for a wide range of applications.

Technical Specifications

Power Management ICs BQ24271RGER attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

4.2 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4 mm

Trade Compliance

BQ24271RGER Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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