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BQ24260SYFFR

Texas Instruments

BQ24260SYFFR by Texas Instruments

BQ24260SYFFR by Texas Instruments is a Power Management IC with 36 terminals, operating at -40 to 85 °C. It has a supply voltage range of 4.2-28V and features adjustable threshold voltage. Ideal for industrial applications requiring precise power supply management in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,992 parts In-Stock

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3,992

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Digiode

USA . 3,795 parts In-Stock

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3,795

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Distributors (Availability)

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Ampacity Inc.

Singapore . 787 parts In-Stock

1+ parts

$1.500

100+ parts

-

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787

$1.500

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Semicontronic

India . 423 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

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423

$3.500

$3.412

$3.395

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One Stop Electronics

USA . 533 parts In-Stock

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$7.500

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-

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533

$7.500

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AZTECH Wire

Italy . 282 parts In-Stock

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$10.527

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282

$10.527

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Parana Technologies

USA . 2,139 parts In-Stock

1+ parts

$10.783

100+ parts

$1,001.387

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$9.705

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2,139

$10.783

$1,001.387

$9.705

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DigiPath Technology Company

USA . 1,527 parts In-Stock

1+ parts

$11.874

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1,527

$11.874

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ChromeModa Solutions

Germany . 2,702 parts In-Stock

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$12.116

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$9.935

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2,702

$12.116

$9.935

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IDEA Electronic Components Group

UK . 175 parts In-Stock

1+ parts

$12.116

100+ parts

$11.510

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$10.904

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175

$12.116

$11.510

$10.904

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Corphita

USA . 3,435 parts In-Stock

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3,435

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A-Z Elektronik GmbH

Germany . 1,847 parts In-Stock

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Northwest PG Solutions

USA . 1,788 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,231 parts In-Stock

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Native Components

USA . 573 parts In-Stock

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573

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Microchip USA

USA . 259 parts In-Stock

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259

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Corohmni

South Africa . 197 parts In-Stock

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197

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Overview

Elevate your power management solutions with the BQ24260SYFFR by Texas Instruments. This cutting-edge Power Management IC offers unparalleled quality and reliability, backed by the trusted name of Texas Instruments. Ideal for a wide range of applications, this surface mount device boasts a sleek rectangular package shape and a nominal supply voltage of 5V. With 36 terminals and a thin profile design, this IC provides superior performance in industrial settings. Experience the value and benefits of efficient power supply management with the BQ24260SYFFR - the perfect choice for your next project.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on a PCB, saving space and enabling a streamlined manufacturing process.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard 5V supply voltage makes it widely compatible with common power sources, enhancing flexibility in application.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The package style offers a compact form factor with a fine pitch design, contributing to a space-saving layout on the PCB and efficient heat dissipation.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures ensures reliability and stability in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for consistent performance in extreme cold conditions, making it suitable for diverse applications.

Technical Specifications

Power Management ICs BQ24260SYFFR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RECHARGE THRESHOLD VOLTAGE IS 0.12V

Adjustable Threshold:

YES

JESD-30 Code:

R-XBGA-B36

JESD-609 Code:

e1

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

6.5 mA

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+0.15V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

BQ24260SYFFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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