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BQ24251YFFT

Texas Instruments

BQ24251YFFT by Texas Instruments

BQ24251YFFT by Texas Instruments is a Power Management IC with 30 terminals in a rectangular package. It operates b/w -40 to 85°C, with a supply voltage range of 4.5-10V. Ideal for industrial applications requiring power supply management circuits.

Median Price

$2.737

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$2.450

1k+ parts

$2.190

10k+ parts

$2.060

500

-

$2.450

$2.190

$2.060

DigiKey

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$3.230

1k+ parts

-

10k+ parts

-

500

-

$3.230

-

-

Verical

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.737

10k+ parts

$2.575

250

-

-

$2.737

$2.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,228 parts In-Stock

1+ parts

$2.337

100+ parts

-

1k+ parts

-

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1,228

$2.337

-

-

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Vyrian

USA . 3,816 parts In-Stock

1+ parts

-

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-

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3,816

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DigiKey Marketplace

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$2.560

1k+ parts

-

10k+ parts

-

500

-

$2.560

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 191 parts In-Stock

1+ parts

$2.090

100+ parts

-

1k+ parts

-

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-

191

$2.090

-

-

-

Corphita

USA . 2,603 parts In-Stock

1+ parts

$2.214

100+ parts

-

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2,603

$2.214

-

-

-

Parana Technologies

USA . 281 parts In-Stock

1+ parts

$17.289

100+ parts

-

1k+ parts

$17.504

10k+ parts

-

281

$17.289

-

$17.504

-

ChromeModa Solutions

Germany . 3,540 parts In-Stock

1+ parts

$19.426

100+ parts

$15.929

1k+ parts

-

10k+ parts

-

3,540

$19.426

$15.929

-

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IDEA Electronic Components Group

UK . 1,184 parts In-Stock

1+ parts

$19.426

100+ parts

$18.455

1k+ parts

$17.483

10k+ parts

-

1,184

$19.426

$18.455

$17.483

-

Microchip USA

USA . 217 parts In-Stock

1+ parts

$22.450

100+ parts

$22.380

1k+ parts

$22.380

10k+ parts

$22.310

217

$22.450

$22.380

$22.380

$22.310

DigiPath Technology Company

USA . 1,137 parts In-Stock

1+ parts

-

100+ parts

$17.514

1k+ parts

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1,137

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$17.514

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Perfect Parts

USA . 1,072 parts In-Stock

1+ parts

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1,072

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Northwest PG Solutions

USA . 783 parts In-Stock

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783

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Native Components

USA . 469 parts In-Stock

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469

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Kepictronics

USA . 122 parts In-Stock

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122

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Overview

Unlock the power of efficient energy management with the Texas Instruments BQ24251YFFT Power Management IC. Designed to deliver top-notch performance and reliability, this product is a game-changer in the field of power supplies. With its surface mount capability and industrial-grade temperature grade, it's perfect for a wide range of applications. Trust in Texas Instruments' reputation for excellence and upgrade your power management system today with the BQ24251YFFT. Experience the benefits of cutting-edge technology and superior quality, all in one compact package.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards.

Package Shape: RECTANGULAR

Rectangular shape helps in efficient placement and utilization of space on the circuit board.

Power Supplies (V): 4.5/10

Supports a wide range of power supplies, making it versatile for various applications.

No. of Terminals: 30

With multiple terminals, it allows for connection to various components and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with thin profile and fine pitch enhances the overall space efficiency in the circuit design.

Maximum Operating Temperature: 85 °C

Capable of operating efficiently at high temperatures, ensuring reliability in different environments.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, it can withstand cold conditions without losing functionality.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position makes it easier to integrate into the circuit design and reduces interference.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Specifically designed for power supply management, ensuring optimized performance and efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high temperatures for a short duration during reflow without affecting functionality.

Peak Reflow Temperature °C: 260

Ability to withstand high peak reflow temperature during manufacturing processes.

Nominal Threshold Voltage (V): +3.35V

Stable threshold voltage ensures consistent performance in power management applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and durability in harsh operating conditions.

Maximum Supply Current (Isup): 5 mA

Efficiently manages supply current with a maximum limit of 5 mA, suitable for various power requirements.

Terminal Form: BALL

Ball terminal form provides secure connections and simplifies the installation process.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for precise connections and compact design layout.

Technical Specifications

Power Management ICs BQ24251YFFT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XBGA-B30

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA30,5X6,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/10

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

5 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+3.35V

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BQ24251YFFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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