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BQ24165RGER

Texas Instruments

BQ24165RGER by Texas Instruments

BQ24165RGER by Texas Instruments is a Power Management IC with 24 terminals, operating voltage of 4.2-18V, and temperature range of -40 to 85°C. It is used in industrial applications for power supply support circuits due to its BUCK switcher configuration and adjustable threshold feature.

Median Price

$4.000

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,311 parts In-Stock

1+ parts

$4.000

100+ parts

$3.505

1k+ parts

$1.980

10k+ parts

-

15,311

$4.000

$3.505

$1.980

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$1.980

100+ parts

-

1k+ parts

-

10k+ parts

-

900

$1.980

-

-

-

Digiode

USA . 2,522 parts In-Stock

1+ parts

$3.800

100+ parts

-

1k+ parts

-

10k+ parts

-

2,522

$3.800

-

-

-

Vyrian

USA . 15,119 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,119

-

-

-

-

Cyclops Electronics Ltd

UK . 11,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,880

-

-

-

-

VNN

France . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

750

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 50 parts In-Stock

1+ parts

$1.940

100+ parts

-

1k+ parts

$1.863

10k+ parts

-

50

$1.940

-

$1.863

-

Continental Prestige Electronics

USA . 3,769 parts In-Stock

1+ parts

$1.980

100+ parts

-

1k+ parts

-

10k+ parts

$1.940

3,769

$1.980

-

-

$1.940

Argo Parts USA

USA . 1,578 parts In-Stock

1+ parts

$1.980

100+ parts

-

1k+ parts

-

10k+ parts

-

1,578

$1.980

-

-

-

Corohmni

South Africa . 308 parts In-Stock

1+ parts

$3.241

100+ parts

-

1k+ parts

-

10k+ parts

-

308

$3.241

-

-

-

Semicontronic

India . 15,171 parts In-Stock

1+ parts

$3.400

100+ parts

$3.315

1k+ parts

$3.298

10k+ parts

-

15,171

$3.400

$3.315

$3.298

-

Ampacity Inc.

Singapore . 14,865 parts In-Stock

1+ parts

$3.400

100+ parts

-

1k+ parts

-

10k+ parts

-

14,865

$3.400

-

-

-

Corphita

USA . 86 parts In-Stock

1+ parts

$3.600

100+ parts

-

1k+ parts

-

10k+ parts

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86

$3.600

-

-

-

Parana Technologies

USA . 1,316 parts In-Stock

1+ parts

$6.825

100+ parts

-

1k+ parts

$7.461

10k+ parts

-

1,316

$6.825

-

$7.461

-

DigiPath Technology Company

USA . 433 parts In-Stock

1+ parts

$7.516

100+ parts

-

1k+ parts

-

10k+ parts

-

433

$7.516

-

-

-

ChromeModa Solutions

Germany . 1,575 parts In-Stock

1+ parts

$7.669

100+ parts

$6.289

1k+ parts

-

10k+ parts

-

1,575

$7.669

$6.289

-

-

IDEA Electronic Components Group

UK . 797 parts In-Stock

1+ parts

$7.669

100+ parts

-

1k+ parts

$6.902

10k+ parts

-

797

$7.669

-

$6.902

-

AZTECH Wire

Italy . 45 parts In-Stock

1+ parts

$13.780

100+ parts

-

1k+ parts

-

10k+ parts

-

45

$13.780

-

-

-

Overview

Experience unparalleled power management with the BQ24165RGER by Texas Instruments. As a trusted industry leader, Texas Instruments delivers top-quality Power Management ICs that exceed expectations. The BQ24165RGER is a versatile solution suitable for a wide range of applications. Offering a compact design and high performance, this chip carrier with a very thin profile ensures optimal power supply support. With an adjustable threshold and robust build, this Industrial-grade device provides customers with reliable and efficient power management for their projects. Elevate your power management capabilities with the BQ24165RGER from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this power management IC lightweight and durable, ideal for portable devices.

Surface Mount: YES

With surface mount capability, this IC can be easily integrated onto circuit boards, saving space and making assembly more efficient.

Package Shape: SQUARE

The square package shape provides stability and ease of placement on a PCB, ensuring a secure connection and optimal performance.

Power Supplies (V): 4.2/18

This IC supports a wide range of power supply voltages from 4.2V to 18V, making it versatile for various applications.

No. of Terminals: 24

With 24 terminals, this IC allows for multiple connections and interfaces, enabling complex power management functions.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier, heat sink/slug, and very thin profile package styles help dissipate heat efficiently, maintaining the IC's performance and reliability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the IC can withstand harsh environmental conditions without compromising its functionality.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the IC to operate in extreme cold environments, making it suitable for a wide range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

The quad terminal position allows for easy soldering and secure connections, enhancing the overall stability and performance of the IC.

Technical Specifications

Power Management ICs BQ24165RGER attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.2/18

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

4.2 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+3.8V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4 mm

Trade Compliance

BQ24165RGER Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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