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BQ24157YFFT

Texas Instruments

BQ24157YFFT by Texas Instruments

BQ24157YFFT by Texas Instruments is a Power Management IC with 20 terminals in a rectangular package. It operates at temperatures from -30 to 85°C and has an adjustable threshold voltage of +3.3V, making it suitable for power supply management circuits in various applications. With a max supply voltage of 6V and a switcher configuration of BUCK, this IC offers efficient power management solutions.

Median Price

$2.006

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,500 parts In-Stock

1+ parts

$1.693

100+ parts

$1.399

1k+ parts

$0.756

10k+ parts

-

1,500

$1.693

$1.399

$0.756

-

DigiKey

USA . 427 parts In-Stock

1+ parts

$2.320

100+ parts

$1.408

1k+ parts

$1.330

10k+ parts

-

427

$2.320

$1.408

$1.330

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,074 parts In-Stock

1+ parts

$1.608

100+ parts

-

1k+ parts

-

10k+ parts

-

4,074

$1.608

-

-

-

Chip Stock

USA . 32,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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32,500

-

-

-

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Vyrian

USA . 6,852 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,852

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 622 parts In-Stock

1+ parts

$1.440

100+ parts

$1.404

1k+ parts

$1.397

10k+ parts

-

622

$1.440

$1.404

$1.397

-

Ampacity Inc.

Singapore . 579 parts In-Stock

1+ parts

$1.440

100+ parts

-

1k+ parts

-

10k+ parts

-

579

$1.440

-

-

-

Corphita

USA . 1,491 parts In-Stock

1+ parts

$1.524

100+ parts

-

1k+ parts

-

10k+ parts

-

1,491

$1.524

-

-

-

Corohmni

South Africa . 329 parts In-Stock

1+ parts

$1.693

100+ parts

-

1k+ parts

-

10k+ parts

-

329

$1.693

-

-

-

Microchip USA

USA . 1,459 parts In-Stock

1+ parts

$9.926

100+ parts

-

1k+ parts

-

10k+ parts

-

1,459

$9.926

-

-

-

Parana Technologies

USA . 2,119 parts In-Stock

1+ parts

$20.979

100+ parts

-

1k+ parts

$21.195

10k+ parts

-

2,119

$20.979

-

$21.195

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DigiPath Technology Company

USA . 1,350 parts In-Stock

1+ parts

$23.101

100+ parts

$21.253

1k+ parts

-

10k+ parts

-

1,350

$23.101

$21.253

-

-

ChromeModa Solutions

Germany . 1,586 parts In-Stock

1+ parts

$23.572

100+ parts

$19.329

1k+ parts

-

10k+ parts

-

1,586

$23.572

$19.329

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-

IDEA Electronic Components Group

UK . 1,022 parts In-Stock

1+ parts

$23.572

100+ parts

$22.393

1k+ parts

$21.215

10k+ parts

-

1,022

$23.572

$22.393

$21.215

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Northwest PG Solutions

USA . 2,109 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,109

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-

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A-Z Elektronik GmbH

Germany . 500 parts In-Stock

1+ parts

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100+ parts

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500

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Native Components

USA . 218 parts In-Stock

1+ parts

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218

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Kepictronics

USA . 138 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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138

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Overview

Enhance your power management capabilities with the BQ24157YFFT from Texas Instruments. This high-quality Power Management IC offers unparalleled efficiency and reliability, making it the perfect choice for a wide range of applications. With its surface mount design and advanced features, this product delivers exceptional performance while ensuring maximum convenience for customers. Trust Texas Instruments to provide cutting-edge solutions that meet your power management needs effortlessly. Elevate your projects with the BQ24157YFFT and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Easy and convenient installation on circuit boards, saving space and simplifying assembly process.

Nominal Supply Voltage (Vsup): 5 V

Suitable for a wide range of applications that require a 5V power supply.

Maximum Operating Temperature: 85 °C

Ability to operate efficiently at high temperatures, ensuring reliability in various environments.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Compact and efficient packaging design allows for optimal use of space on the circuit board.

Minimum Supply Voltage (Vsup): 4 V

Capable of functioning even with a minimum supply voltage of 4V, providing flexibility in power source options.

Maximum Seated Height: 0.625 mm

Low profile design helps in reducing overall height of the product, ideal for applications with space constraints.

Minimum Operating Temperature: -30 °C

Ability to operate in extremely cold temperatures, making it suitable for a wide range of environments.

Switcher Config: BUCK

Efficient buck converter configuration helps in reducing power loss and improving overall energy efficiency.

Technical Specifications

Power Management ICs BQ24157YFFT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RECHARGE THRESHOLD VOLTAGE IS 0.12V

Adjustable Threshold:

YES

JESD-30 Code:

R-XBGA-B20

JESD-609 Code:

e1

Length:

2.142 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA20,4X5,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+3.3V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

BQ24157YFFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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