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BQ24153YFFR

Texas Instruments

BQ24153YFFR by Texas Instruments

BQ24153YFFR by Texas Instruments is a Power Management IC with 20 terminals, operating b/w -40 to 85°C. It features a Buck switcher configuration, adjustable threshold, and supports supply voltages from 4V to 6V. Ideal for industrial applications requiring precise power supply support in a compact rectangular package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,982 parts In-Stock

1+ parts

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4,982

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Vyrian

USA . 4,011 parts In-Stock

1+ parts

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4,011

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,353 parts In-Stock

1+ parts

$1.119

100+ parts

-

1k+ parts

$1.948

10k+ parts

-

2,353

$1.119

-

$1.948

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DigiPath Technology Company

USA . 2,286 parts In-Stock

1+ parts

$1.232

100+ parts

-

1k+ parts

-

10k+ parts

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2,286

$1.232

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ChromeModa Solutions

Germany . 1,975 parts In-Stock

1+ parts

$1.257

100+ parts

$1.031

1k+ parts

-

10k+ parts

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1,975

$1.257

$1.031

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IDEA Electronic Components Group

UK . 898 parts In-Stock

1+ parts

$1.257

100+ parts

-

1k+ parts

$1.131

10k+ parts

-

898

$1.257

-

$1.131

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Native Components

USA . 271 parts In-Stock

1+ parts

$1.680

100+ parts

-

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271

$1.680

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Northwest PG Solutions

USA . 2,363 parts In-Stock

1+ parts

$1.848

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2,363

$1.848

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Ampacity Inc.

Singapore . 1,098 parts In-Stock

1+ parts

$2.500

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1,098

$2.500

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One Stop Electronics

USA . 1,271 parts In-Stock

1+ parts

$4.500

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1,271

$4.500

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Semicontronic

India . 502 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

10k+ parts

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502

$4.500

$4.388

$4.365

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AZTECH Wire

Italy . 246 parts In-Stock

1+ parts

$6.809

100+ parts

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246

$6.809

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Microchip USA

USA . 4,576 parts In-Stock

1+ parts

$16.080

100+ parts

$15.850

1k+ parts

$15.740

10k+ parts

$15.620

4,576

$16.080

$15.850

$15.740

$15.620

Component Stockers USA

USA . 425 parts In-Stock

1+ parts

$80.200

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425

$80.200

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A-Z Elektronik GmbH

Germany . 6,546 parts In-Stock

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6,546

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Alle Elektronik GmbH

Germany . 4,364 parts In-Stock

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4,364

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Corphita

USA . 520 parts In-Stock

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520

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Corohmni

South Africa . 76 parts In-Stock

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76

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ChipstoGo Electronic ltd

UK . 25 parts In-Stock

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25

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Overview

Experience the next level of power management with the BQ24153YFFR by Texas Instruments. Designed with precision and innovation, this Power Management IC offers unmatched efficiency and reliability for a wide range of applications. Whether you're in need of a compact solution for your industrial project or looking to enhance the performance of your device, this product delivers exceptional value, benefits, and advantages that will exceed your expectations. Trust in Texas Instruments to provide cutting-edge technology that empowers your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The package body material being plastic/epoxy makes the product lightweight and durable, which is ideal for portable devices or products that may experience some level of physical stress.

Surface Mount: YES

Being surface-mountable allows for easier and more efficient PCB assembly, making the product suitable for mass production and integration into compact electronic devices.

Nominal Supply Voltage (Vsup): 5 V

The nominal supply voltage of 5 V is a common and standard voltage level, making the product compatible with a wide range of electronic systems and applications.

No. of Terminals: 20

Having 20 terminals provides flexibility and functionality in connecting various components and peripherals, allowing for versatile usage in different power management scenarios.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can reliably handle higher temperature environments, making it suitable for industrial and demanding applications.

Minimum Operating Temperature: -40 °C

The ability to operate at a minimum temperature of -40°C ensures reliable performance even in cold temperature conditions, making it ideal for a wide range of environments and applications.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch allows for a compact design, saving valuable PCB space and enabling the product to be used in small form factor devices.

Adjustable Threshold: YES

The ability to adjust the threshold allows for customization and optimization of the power management settings to suit specific requirements, making the product versatile and adaptable to different use cases.

Technical Specifications

Power Management ICs BQ24153YFFR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B20

Length:

2.305 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.905 mm

Trade Compliance

BQ24153YFFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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