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BQ24153AYFFT

Texas Instruments

BQ24153AYFFT by Texas Instruments

BQ24153AYFFT by Texas Instruments is a Power Management IC with 20 terminals, supporting a supply voltage range of 4-6V. It features a BUCK switcher configuration and adjustable threshold. Ideal for industrial applications requiring precise power supply support in compact spaces.

Median Price

$5.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,700 parts In-Stock

1+ parts

$5.292

100+ parts

$4.314

1k+ parts

$2.876

10k+ parts

-

10,700

$5.292

$4.314

$2.876

-

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.708

10k+ parts

$4.585

250

-

-

$4.708

$4.585

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 316 parts In-Stock

1+ parts

$5.027

100+ parts

-

1k+ parts

-

10k+ parts

-

316

$5.027

-

-

-

Vyrian

USA . 5,215 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,215

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 5,388 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

10k+ parts

-

5,388

$4.500

$4.388

$4.365

-

Ampacity Inc.

Singapore . 5,039 parts In-Stock

1+ parts

$4.500

100+ parts

-

1k+ parts

-

10k+ parts

-

5,039

$4.500

-

-

-

Corphita

USA . 633 parts In-Stock

1+ parts

$4.763

100+ parts

-

1k+ parts

-

10k+ parts

-

633

$4.763

-

-

-

Corohmni

South Africa . 441 parts In-Stock

1+ parts

$5.292

100+ parts

-

1k+ parts

-

10k+ parts

-

441

$5.292

-

-

-

Parana Technologies

USA . 228 parts In-Stock

1+ parts

$12.819

100+ parts

-

1k+ parts

$13.289

10k+ parts

-

228

$12.819

-

$13.289

-

DigiPath Technology Company

USA . 1,165 parts In-Stock

1+ parts

$14.115

100+ parts

$12.986

1k+ parts

-

10k+ parts

-

1,165

$14.115

$12.986

-

-

ChromeModa Solutions

Germany . 4,136 parts In-Stock

1+ parts

$14.403

100+ parts

$11.810

1k+ parts

-

10k+ parts

-

4,136

$14.403

$11.810

-

-

IDEA Electronic Components Group

UK . 1,056 parts In-Stock

1+ parts

$14.403

100+ parts

$13.683

1k+ parts

$12.963

10k+ parts

-

1,056

$14.403

$13.683

$12.963

-

Microchip USA

USA . 2,802 parts In-Stock

1+ parts

$32.100

100+ parts

$31.900

1k+ parts

$31.800

10k+ parts

$31.700

2,802

$32.100

$31.900

$31.800

$31.700

Native Components

USA . 92 parts In-Stock

1+ parts

$160.866

100+ parts

-

1k+ parts

-

10k+ parts

$154.431

92

$160.866

-

-

$154.431

Northwest PG Solutions

USA . 2,267 parts In-Stock

1+ parts

$176.953

100+ parts

-

1k+ parts

-

10k+ parts

-

2,267

$176.953

-

-

-

Overview

Power up your devices with the BQ24153AYFFT by Texas Instruments, a high-quality Power Management IC designed to provide efficient and reliable power supply support. With a wide operating temperature range and adjustable threshold, this surface mount chip is perfect for industrial applications where precision and performance are key. Trust in Texas Instruments' reputation for excellence and innovation, and experience the value and benefits that the BQ24153AYFFT can bring to your projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount package allows for easy and convenient installation on circuit boards, saving space and providing efficient heat dissipation.

Package Shape: RECTANGULAR

Rectangular shape allows for a compact design, making it suitable for applications where space is limited.

Nominal Supply Voltage (Vsup): 5 V

Stable 5V supply voltage ensures reliable and consistent power delivery to connected components.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options, making it compatible with a wide range of devices.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package with very thin profile and fine pitch design enables high-density mounting and efficient signal routing.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures stable performance even in harsh environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C makes this product suitable for use in a wide range of temperature conditions.

Terminal Finish: TIN SILVER COPPER

Terminal finish of Tin Silver Copper provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, making installation and maintenance easier.

Maximum Seated Height: 0.625 mm

Low maximum seated height of 0.625mm allows for a compact and streamlined design, ideal for space-constrained applications.

Width (mm): 2 mm

Narrow width of 2mm enables efficient use of PCB real estate, contributing to overall system miniaturization.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this IC provides the necessary functions to ensure stable and efficient power delivery to connected devices.

Minimum Supply Voltage (Vsup): 4 V

Minimum supply voltage of 4V allows for flexibility in power input options, accommodating a variety of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Maximum time of 30 seconds at peak reflow temperature ensures safe and effective soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C enables reliable soldering connections, ensuring durability and longevity of the product.

Length: 2.14 mm

Compact length of 2.14mm allows for space-efficient integration into a wide range of electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in demanding industrial applications, where temperature fluctuations are common.

Terminal Form: BALL

Ball terminal form enables easy and secure connection to PCB pads, ensuring reliable electrical contact and signal transmission.

Switcher Config: BUCK

Buck switcher configuration offers efficient voltage regulation and power conversion, making the product suitable for various power management applications.

Terminal Pitch: 0.4 mm

Fine terminal pitch of 0.4mm allows for high-density mounting, enabling compact and space-efficient PCB designs.

Maximum Supply Voltage (Vsup): 6 V

Maximum supply voltage of 6V provides a wide operating voltage range, accommodating different power input requirements.

Adjustable Threshold: YES

Ability to adjust the threshold allows for customization and fine-tuning of power management parameters, enhancing flexibility and performance optimization.

Technical Specifications

Power Management ICs BQ24153AYFFT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-XBGA-B20

JESD-609 Code:

e1

Length:

2.14 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

BQ24153AYFFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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