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BQ24123RHLRG4

Texas Instruments

BQ24123RHLRG4 by Texas Instruments

BQ24123RHLRG4 by Texas Instruments is a Power Management IC with 20 terminals, operating b/w -40 to 85°C. It supports a min supply voltage of 4.35V and has a max supply current of 5mA. Ideal for industrial applications requiring a BUCK switcher configuration in compact designs.

Median Price

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Lifecycle Status

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6

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1k+

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Chip Stock

USA . 34,487 parts In-Stock

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Vyrian

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Digiode

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Nova Conductors

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Cyclops Electronics Ltd

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One Stop Electronics

USA . 1,271 parts In-Stock

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Ampacity Inc.

Singapore . 1,643 parts In-Stock

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$7.500

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AZTECH Wire

Italy . 459 parts In-Stock

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Corohmni

South Africa . 693 parts In-Stock

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Microchip USA

USA . 2,675 parts In-Stock

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$13.470

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$13.390

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Parana Technologies

USA . 729 parts In-Stock

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DigiPath Technology Company

USA . 1,938 parts In-Stock

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IDEA Electronic Components Group

UK . 1,765 parts In-Stock

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ChromeModa Solutions

Germany . 1,374 parts In-Stock

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Overview

Power up your devices with the BQ24123RHLRG4 by Texas Instruments. Known for their high-quality power management ICs, Texas Instruments brings you a reliable and efficient solution for all your power supply needs. Whether you're looking to optimize battery charging or enhance power delivery, this versatile chip carrier offers superior performance in a compact and durable package. From industrial applications to consumer electronics, the BQ24123RHLRG4 is the perfect choice to ensure seamless power management with ease. Elevate your products with Texas Instruments today.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material is durable and lightweight, making the product easy to handle and transport.

Surface Mount

YES - This feature allows for easy installation on circuit boards, saving time and effort during assembly.

Package Shape

RECTANGULAR - The rectangular shape makes it easy to integrate into various electronic devices without taking up too much space.

No. of Terminals

20 - With a high number of terminals, this IC can support complex power management functions efficiently.

Package Style

CHIP CARRIER, HEAT SINK/SLUG - The dual package style provides enhanced heat dissipation, ensuring optimal performance under high loads.

Maximum Operating Temperature

85 °C - The high operating temperature range allows the IC to function reliably in various environmental conditions.

Minimum Operating Temperature

40 °C - The low operating temperature range ensures the IC can withstand extreme cold environments without failing.

Terminal Finish

NICKEL PALLADIUM GOLD - This finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position

QUAD - The quad terminal position enables easy and secure connections to the circuit board, reducing the risk of loose connections.

Maximum Seated Height

1 mm - The low seated height allows for a compact design, ideal for space-constrained applications.

Width

3.5 mm - The slim width of the IC enables it to fit into tight spaces within electronic devices without compromising functionality.

Other IC type

POWER SUPPLY SUPPORT CIRCUIT - This IC is specifically designed to provide robust power management support, ensuring stable operation of electronic devices.

Minimum Supply Voltage (Vsup)

4.35 V - This low minimum supply voltage requirement allows the IC to operate efficiently even with limited power sources.

Maximum Time At Peak Reflow Temperature

30s - The extended time at peak reflow temperature simplifies the assembly process, reducing the risk of component damage.

Peak Reflow Temperature

260 °C - The high peak reflow temperature tolerance ensures the IC can withstand the soldering process without degradation.

Length

4.5 mm - The compact length of the IC makes it suitable for space-constrained applications where size is a critical factor.

Nominal Threshold Voltage (V)

+3.3V - This threshold voltage level ensures stable performance and reliability in power management applications.

Temperature Grade

INDUSTRIAL - The industrial-grade temperature rating makes this IC suitable for use in rugged environments where temperature fluctuations are common.

Maximum Supply Current (Isup)

5 mA - The low supply current requirement minimizes power consumption, making the IC energy-efficient.

Terminal Form

NO LEAD - The lead-free terminal form reduces environmental impact and ensures compliance with industry regulations.

Switcher Config

BUCK - The buck switcher configuration offers efficient voltage regulation, making this IC ideal for power-saving applications.

Terminal Pitch

0.5 mm - The small terminal pitch enables high-density mounting, maximizing board space utilization and improving overall system performance.

Moisture Sensitivity Level (MSL)

2 - With a low moisture sensitivity level, the IC is less prone to damage during storage and soldering processes.

Maximum Supply Voltage (Vsup)

16 V - The high maximum supply voltage tolerance allows the IC to handle a wide range of input voltage levels, enhancing versatility in power management applications.

Technical Specifications

Power Management ICs BQ24123RHLRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.35 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+3.3V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

BQ24123RHLRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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