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BQ24103RHLRG4

Texas Instruments

BQ24103RHLRG4 by Texas Instruments

BQ24103RHLRG4 by Texas Instruments is a Power Management IC with 20 terminals, operating temperature range of -40 to 85°C. It supports power supply circuits, has a min supply voltage of 4.35V, and operates as a BUCK switcher with max supply current of 5mA. Ideal for industrial applications requiring precise power management in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 14,840 parts In-Stock

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14,840

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Vyrian

USA . 6,531 parts In-Stock

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6,531

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VNN

France . 2,779 parts In-Stock

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2,779

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Digiode

USA . 2,555 parts In-Stock

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2,555

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,607 parts In-Stock

1+ parts

$0.500

100+ parts

-

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1,607

$0.500

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One Stop Electronics

USA . 575 parts In-Stock

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$1.500

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575

$1.500

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Parana Technologies

USA . 2,033 parts In-Stock

1+ parts

$2.725

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-

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$3.208

10k+ parts

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2,033

$2.725

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$3.208

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DigiPath Technology Company

USA . 1,150 parts In-Stock

1+ parts

$3.001

100+ parts

$2.761

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1,150

$3.001

$2.761

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ChromeModa Solutions

Germany . 5,068 parts In-Stock

1+ parts

$3.062

100+ parts

$2.511

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5,068

$3.062

$2.511

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IDEA Electronic Components Group

UK . 1,083 parts In-Stock

1+ parts

$3.062

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$2.756

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1,083

$3.062

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$2.756

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Semicontronic

India . 466 parts In-Stock

1+ parts

$5.500

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$5.362

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$5.335

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466

$5.500

$5.362

$5.335

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Corohmni

South Africa . 442 parts In-Stock

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$8.346

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442

$8.346

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AZTECH Wire

Italy . 582 parts In-Stock

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$19.183

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582

$19.183

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Argo Parts USA

USA . 3,805 parts In-Stock

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Continental Prestige Electronics

USA . 3,080 parts In-Stock

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Corphita

USA . 3,025 parts In-Stock

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3,025

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Microchip USA

USA . 1,143 parts In-Stock

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1,143

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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Advanced Electronics

New Zealand . 450 parts In-Stock

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450

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Overview

Experience exceptional power management with the BQ24103RHLRG4 by Texas Instruments, a leading manufacturer in the industry. This Power Management IC offers unparalleled quality and reliability for a variety of applications, ensuring optimal performance and efficiency. With advanced features and a compact design, this chip carrier package delivers superior results while maintaining a very thin profile. Trust Texas Instruments to provide innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the BQ24103RHLRG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort.

Package Shape: RECTANGULAR

Facilitates efficient use of space on the PCB, optimizing overall system design.

No. of Terminals: 20

Offers versatility and compatibility with a variety of applications.

Minimum Operating Temperature: -40 °C

Ensures reliable performance even in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for improved signal transmission.

Width: 3.5 mm

Compact size allows for high-density mounting, ideal for space-constrained designs.

Minimum Supply Voltage (Vsup): 4.35 V

Enables compatibility with low-power applications, maximizing efficiency.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable operation.

Switcher Config: BUCK

Efficient buck converter configuration helps optimize power efficiency and reduce heat dissipation.

Technical Specifications

Power Management ICs BQ24103RHLRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.35 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

BQ24103RHLRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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