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BQ24003PWPG4

Texas Instruments

BQ24003PWPG4 by Texas Instruments

BQ24003PWPG4 by Texas Instruments is a Power Management IC with 20 terminals, operating b/w 0-70°C. It supports a supply voltage range of 4.5-10V and has an adjustable threshold feature. Ideal for power supply support circuits in commercial-grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,949 parts In-Stock

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4,949

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Digiode

USA . 1,908 parts In-Stock

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1,908

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,260 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

10k+ parts

-

1,260

$0.500

$0.488

$0.485

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Ampacity Inc.

Singapore . 517 parts In-Stock

1+ parts

$2.500

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-

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517

$2.500

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Northwest PG Solutions

USA . 1,187 parts In-Stock

1+ parts

$3.212

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-

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1,187

$3.212

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One Stop Electronics

USA . 189 parts In-Stock

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$6.500

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189

$6.500

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Parana Technologies

USA . 2,347 parts In-Stock

1+ parts

$12.058

100+ parts

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$12.465

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2,347

$12.058

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$12.465

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Corohmni

South Africa . 246 parts In-Stock

1+ parts

$12.452

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246

$12.452

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DigiPath Technology Company

USA . 2,126 parts In-Stock

1+ parts

$13.277

100+ parts

$12.215

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2,126

$13.277

$12.215

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ChromeModa Solutions

Germany . 3,712 parts In-Stock

1+ parts

$13.548

100+ parts

$11.109

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3,712

$13.548

$11.109

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IDEA Electronic Components Group

UK . 716 parts In-Stock

1+ parts

$13.548

100+ parts

$12.871

1k+ parts

$12.193

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716

$13.548

$12.871

$12.193

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AZTECH Wire

Italy . 639 parts In-Stock

1+ parts

$18.320

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639

$18.320

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$25.750

100+ parts

$23.433

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$21.115

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2,500

$25.750

$23.433

$21.115

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Component Stockers USA

USA . 764 parts In-Stock

1+ parts

$99.990

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764

$99.990

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Corphita

USA . 4,967 parts In-Stock

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4,967

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Microchip USA

USA . 2,963 parts In-Stock

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2,963

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Native Components

USA . 978 parts In-Stock

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$2.832

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978

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$2.832

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Perfect Parts

USA . 235 parts In-Stock

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235

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Overview

Power up your devices with the reliable and efficient BQ24003PWPG4 Power Management IC from Texas Instruments. Known for their superior quality and innovative technology, Texas Instruments delivers cutting-edge solutions for a variety of applications. This small outline, heat sink package offers a thin profile and dual terminal position, making it perfect for power supply support circuits. With an adjustable threshold and a wide operating temperature range, this IC provides exceptional value and performance for all your power management needs. Upgrade to Texas Instruments for top-of-the-line quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and heat resistance for the Power Management IC, ensuring a long lifespan and reliable performance.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during production.

Nominal Supply Voltage (Vsup): 5 V

Standard voltage level that is compatible with many electronic devices, making it versatile for various applications.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Compact design with heat sink capabilities ensures efficient power management and thermal dissipation in limited space.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, making it suitable for use in various environments without risk of overheating.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent conductivity and corrosion resistance, ensuring reliable connections for efficient power distribution.

Width (mm): 4.4 mm

Compact width allows for space-saving integration into electronic devices without sacrificing performance.

Minimum Supply Voltage (Vsup): 4.5 V

Ability to function at lower voltage levels makes it energy-efficient and suitable for battery-powered applications.

Maximum Seated Height: 1.2 mm

Low profile design allows for easy integration into compact electronic devices while optimizing space utilization.

Adjustable Threshold: YES

Ability to adjust threshold levels for different applications provides flexibility and customization in power management settings.

Technical Specifications

Power Management ICs BQ24003PWPG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

OPTIONAL TEMPERATURE OR INPUT-POWER MONITORING BEFORE AND DURING CHARGE

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

BQ24003PWPG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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