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BQ20Z95DBTG4

Texas Instruments

BQ20Z95DBTG4 by Texas Instruments

BQ20Z95DBTG4 by Texas Instruments is a Power Management IC with 44 terminals, operating b/w -40 to 85°C. It supports supply voltages from 4.5V to 25V and has an adjustable threshold feature. Ideal for industrial applications requiring precise power management in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,564 parts In-Stock

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Vyrian

USA . 2,716 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 47 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,495 parts In-Stock

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$0.500

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1,495

$0.500

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Parana Technologies

USA . 1,598 parts In-Stock

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$3.465

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$3.990

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1,598

$3.465

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$3.990

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ChromeModa Solutions

Germany . 3,994 parts In-Stock

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$3.893

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$3.192

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3,994

$3.893

$3.192

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IDEA Electronic Components Group

UK . 1,474 parts In-Stock

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$3.893

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$3.504

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1,474

$3.893

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$3.504

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AZTECH Wire

Italy . 482 parts In-Stock

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$5.724

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482

$5.724

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Component Stockers USA

USA . 678 parts In-Stock

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$99.990

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Microchip USA

USA . 1,420 parts In-Stock

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Corphita

USA . 860 parts In-Stock

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DigiPath Technology Company

USA . 660 parts In-Stock

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$3.510

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$3.510

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Northwest PG Solutions

USA . 242 parts In-Stock

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Native Components

USA . 89 parts In-Stock

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Perfect Parts

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Overview

Experience the cutting-edge technology of the BQ20Z95DBTG4 by Texas Instruments, a top-of-the-line Power Management IC that offers unmatched quality and reliability. Manufactured by industry leader Texas Instruments, this versatile product is perfect for a wide range of applications in power supply support circuits. With its compact design and adjustable threshold, customers can enjoy the benefits of optimal power management while maximizing efficiency. Trust Texas Instruments for state-of-the-art solutions that deliver exceptional performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is commonly used in power management ICs for its durability and resistance to heat, making this product suitable for various applications.

Nominal Supply Voltage (Vsup): 14 V

With a nominal supply voltage of 14 V, this power management IC can efficiently handle power inputs within this range, ensuring stable performance.

No. of Terminals: 44

Having 44 terminals allows for more connections and flexibility in building complex power supply circuits, making this product versatile for different designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable operation in various environments, making this power management IC suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this power management IC can withstand extreme cold conditions, providing reliable performance in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish enhances conductivity and corrosion resistance, ensuring stable connections and long-term reliability of the product.

Technical Specifications

Power Management ICs BQ20Z95DBTG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e4

Length:

11 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP44,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/25

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

25 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

14 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

BQ20Z95DBTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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