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BQ2084RTTR-V140G4

Texas Instruments

BQ2084RTTR-V140G4 by Texas Instruments

BQ2084RTTR-V140G4 by Texas Instruments is a Power Management IC with 36 terminals, operating b/w -20 to 85°C. It has a supply voltage range of 3-3.6V and adjustable threshold feature. This chip carrier is suitable for power supply support circuits in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,890 parts In-Stock

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7,890

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Digiode

USA . 4,440 parts In-Stock

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4,440

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One Stop Electronics

USA . 1,288 parts In-Stock

1+ parts

$1.500

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1,288

$1.500

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Ampacity Inc.

Singapore . 1,271 parts In-Stock

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$1.500

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$1.500

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Semicontronic

India . 824 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

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$4.365

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824

$4.500

$4.388

$4.365

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AZTECH Wire

Italy . 611 parts In-Stock

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$10.481

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611

$10.481

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Parana Technologies

USA . 778 parts In-Stock

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$12.249

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$12.673

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778

$12.249

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$12.673

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IDEA Electronic Components Group

UK . 1,799 parts In-Stock

1+ parts

$13.763

100+ parts

$13.075

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$12.387

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1,799

$13.763

$13.075

$12.387

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ChromeModa Solutions

Germany . 441 parts In-Stock

1+ parts

$13.763

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$11.286

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441

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$11.286

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Corphita

USA . 3,776 parts In-Stock

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Microchip USA

USA . 3,754 parts In-Stock

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Northwest PG Solutions

USA . 1,441 parts In-Stock

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DigiPath Technology Company

USA . 948 parts In-Stock

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$12.409

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948

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Native Components

USA . 846 parts In-Stock

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Corohmni

South Africa . 91 parts In-Stock

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Overview

Elevate your power management capabilities with the BQ2084RTTR-V140G4 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge Power Management ICs that are essential for a wide range of applications. This chip carrier offers a very thin profile and heat sink/slug package style, making it versatile and efficient for various electronic devices. With an adjustable threshold and nominal supply voltage of 3.3V, this product ensures optimal performance and power efficiency. Trust Texas Instruments to provide you with the best solutions for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for various operating conditions.

Surface Mount: YES

Surface mount feature allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular package shape enables efficient use of PCB space and facilitates easy integration into electronic devices.

Nominal Supply Voltage (Vsup): 3.3 V

Stable supply voltage of 3.3V ensures reliable performance of the power management IC.

Power Supplies (V): 3.3

Matching power supply voltage of 3.3V ensures compatibility with standard electronic devices.

No. of Terminals: 36

Having 36 terminals allows for connecting to multiple components and peripherals, making the product versatile and flexible in application.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of chip carrier, heat sink/slug, and very thin profile package styles provides thermal management and space-saving benefits, enhancing the efficiency of the power management IC.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures the product can withstand heat without performance degradation, suitable for industrial and automotive applications.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature of -20°C ensures the product remains functional in cold environments, expanding its usability range.

Terminal Position: QUAD

Quad terminal position enhances connectivity options and simplifies the integration of the IC into different circuit layouts, increasing flexibility and compatibility.

Maximum Seated Height: 0.9 mm

Ultra-low maximum seated height of 0.9mm allows for space-constrained designs, ideal for compact electronic devices and applications.

Width (mm): 5 mm

Narrow width of 5mm saves PCB space and allows for efficient board layout design, contributing to overall system miniaturization.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Inclusion of a power supply support circuit enhances the stability and efficiency of the power management IC, ensuring reliable and consistent power delivery to connected components.

Minimum Supply Voltage (Vsup): 3 V

Minimum supply voltage of 3V ensures compatibility with a wide range of power sources, making the product versatile in different electronic systems and applications.

Length: 6 mm

Compact length of 6mm contributes to space-saving design, making the product suitable for applications with size constraints.

Terminal Form: NO LEAD

No-lead terminal form simplifies the manufacturing process and enhances reliability, ensuring secure and stable connections between the IC and other components.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density packaging and precise connection, enabling the integration of complex circuits in a small footprint.

Maximum Supply Voltage (Vsup): 3.6 V

Maximum supply voltage of 3.6V provides an operating margin and tolerance for voltage spikes, ensuring the IC can handle variations in the input power supply.

Adjustable Threshold: YES

Adjustable threshold feature allows for customization of voltage thresholds, enabling fine-tuning of power management parameters for specific application requirements.

Technical Specifications

Power Management ICs BQ2084RTTR-V140G4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PQCC-N36

Length:

6 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC36,.2X.24,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

5 mm

Trade Compliance

BQ2084RTTR-V140G4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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