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BQ2057PDGKG4

Texas Instruments

BQ2057PDGKG4 by Texas Instruments

BQ2057PDGKG4 by Texas Instruments is a Power Management IC with 8 terminals, Vsup range of 4.5-15V, and adjustable threshold. It comes in a small outline package suitable for power supply support circuits. Operating temperature ranges from -20 to 70°C making it ideal for various electronic applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,498 parts In-Stock

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3,498

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Vyrian

USA . 2,622 parts In-Stock

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2,622

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Distributors (Availability)

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Native Components

USA . 661 parts In-Stock

1+ parts

$0.492

100+ parts

-

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10k+ parts

$0.472

661

$0.492

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$0.472

Northwest PG Solutions

USA . 307 parts In-Stock

1+ parts

$0.541

100+ parts

-

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$0.477

307

$0.541

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$0.477

Semicontronic

India . 1,539 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

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1,539

$4.500

$4.388

$4.365

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One Stop Electronics

USA . 335 parts In-Stock

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$6.500

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335

$6.500

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Parana Technologies

USA . 1,549 parts In-Stock

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$17.847

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$18.025

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1,549

$17.847

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$18.025

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AZTECH Wire

Italy . 564 parts In-Stock

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$19.471

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564

$19.471

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DigiPath Technology Company

USA . 1,282 parts In-Stock

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$19.652

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$18.080

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1,282

$19.652

$18.080

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IDEA Electronic Components Group

UK . 861 parts In-Stock

1+ parts

$20.053

100+ parts

$19.050

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$18.048

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861

$20.053

$19.050

$18.048

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ChromeModa Solutions

Germany . 714 parts In-Stock

1+ parts

$20.053

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$16.443

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714

$20.053

$16.443

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Corphita

USA . 4,877 parts In-Stock

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Microchip USA

USA . 368 parts In-Stock

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Corohmni

South Africa . 153 parts In-Stock

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Overview

Power up your devices with the BQ2057PDGKG4 by Texas Instruments, a top-of-the-line Power Management IC that guarantees quality and reliability. Manufactured with precision and expertise, this small outline, thin profile chip offers a wide range of applications in various industries. With an adjustable threshold and a nominal supply voltage of 5V, the BQ2057PDGKG4 ensures efficient power management while providing outstanding performance. Say goodbye to power supply issues and hello to seamless operation with this innovative product. Upgrade your systems today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and flexibility for the package, making it suitable for various applications.

Surface Mount: YES

The surface mount option allows for easy installation and integration onto circuit boards, saving space and simplifying assembly processes.

Package Shape: SQUARE

The square package shape provides a compact design, allowing for efficient use of space on the circuit board.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage ensures compatibility with a wide range of applications and devices requiring standard voltage levels.

Power Supplies (V): 4.5/15

The wide power supply range of 4.5V to 15V allows for flexibility in powering different components and systems.

No. of Terminals: 8

The 8 terminals provide ample connectivity options for interfacing with other components and devices.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style helps in reducing the overall size and weight of the product, making it suitable for compact designs.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20°C allows for operation in cold environments without any issues.

Terminal Position: DUAL

The dual terminal position offers increased connectivity options and flexibility in circuit board layout.

Maximum Seated Height: 1.1 mm

The low seated height of 1.1 mm helps in achieving a slim and compact overall profile for the product.

Width (mm): 3 mm

The small width of 3 mm contributes to a space-efficient design, particularly useful in applications with tight space constraints.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This power supply support circuit type ensures stable and reliable power delivery to connected components, enhancing overall system performance.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5 V provides a suitable operating range for various applications requiring lower power inputs.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering and rework processes during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C enables reliable soldering of the component onto the circuit board without damage.

Length: 3 mm

The small length of 3 mm helps in achieving a compact form factor for the product, suitable for space-constrained applications.

Maximum Supply Current (Isup): 4 mA

The low maximum supply current of 4 mA indicates efficient power usage and minimizes energy consumption during operation.

Terminal Form: GULL WING

The gull-wing terminal form provides strong mechanical support and secure solder connections for reliable performance.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting on the circuit board, maximizing connectivity in a limited space.

Moisture Sensitivity Level (MSL): 2

The moisture sensitivity level of 2 indicates a moderate sensitivity to moisture during storage and handling, requiring standard precautions for protection.

Maximum Supply Voltage (Vsup): 15 V

The maximum supply voltage of 15 V provides compatibility with higher voltage applications, offering versatility in power source options.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization of operation parameters as per specific application requirements, enhancing flexibility and performance optimization.

Technical Specifications

Power Management ICs BQ2057PDGKG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

4 mA

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

BQ2057PDGKG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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