Loading...

BQ2054SNG4

Texas Instruments

BQ2054SNG4 by Texas Instruments

BQ2054SNG4 by Texas Instruments is a Power Management IC with 16 terminals, operating b/w -20 to 70°C. It features current/voltage-mode control, pulse width modulation technique, and push-pull switcher configuration. Ideal for battery charge control applications due to its small outline package and nickel palladium gold terminal finish.

Median Price

$14.563

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 120 parts In-Stock

1+ parts

-

100+ parts

$11.650

1k+ parts

$10.420

10k+ parts

$9.810

120

-

$11.650

$10.420

$9.810

DigiKey

USA . 120 parts In-Stock

1+ parts

-

100+ parts

$15.330

1k+ parts

-

10k+ parts

-

120

-

$15.330

-

-

Verical

USA . 120 parts In-Stock

1+ parts

-

100+ parts

$14.563

1k+ parts

$13.025

10k+ parts

$12.262

120

-

$14.563

$13.025

$12.262

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,407 parts In-Stock

1+ parts

$4.617

100+ parts

-

1k+ parts

-

10k+ parts

-

1,407

$4.617

-

-

-

Vyrian

USA . 4,020 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,020

-

-

-

-

DigiKey Marketplace

USA . 180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

180

-

-

-

-

PC Components Company LLC

USA . 17 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17

-

-

-

-

Bristol Electronics

USA . 17 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 700 parts In-Stock

1+ parts

$4.347

100+ parts

-

1k+ parts

$4.765

10k+ parts

-

700

$4.347

-

$4.765

-

Corphita

USA . 2,929 parts In-Stock

1+ parts

$4.374

100+ parts

-

1k+ parts

-

10k+ parts

-

2,929

$4.374

-

-

-

ChromeModa Solutions

Germany . 6,688 parts In-Stock

1+ parts

$4.884

100+ parts

$4.005

1k+ parts

-

10k+ parts

-

6,688

$4.884

$4.005

-

-

IDEA Electronic Components Group

UK . 2,041 parts In-Stock

1+ parts

$4.884

100+ parts

-

1k+ parts

$4.396

10k+ parts

-

2,041

$4.884

-

$4.396

-

Native Components

USA . 921 parts In-Stock

1+ parts

$24.546

100+ parts

-

1k+ parts

-

10k+ parts

-

921

$24.546

-

-

-

Northwest PG Solutions

USA . 1,222 parts In-Stock

1+ parts

$27.001

100+ parts

$24.301

1k+ parts

-

10k+ parts

-

1,222

$27.001

$24.301

-

-

Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,790

-

-

-

-

DigiPath Technology Company

USA . 1,623 parts In-Stock

1+ parts

-

100+ parts

$4.403

1k+ parts

-

10k+ parts

-

1,623

-

$4.403

-

-

Overview

Power up your devices with the BQ2054SNG4 by Texas Instruments, a top-quality Power Management IC designed to optimize energy efficiency and prolong battery life. With a reputation for excellence, Texas Instruments delivers reliable solutions for a wide range of applications in the electronics industry. This Battery Charge Controller offers customers exceptional value by providing precise current/voltage control and pulse width modulation techniques. Say goodbye to worries about power management with the BQ2054SNG4 - your go-to solution for efficient and effective energy management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic or epoxy material provides good durability and protection for the IC, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability makes it easy to integrate this Power Management IC into a circuit board, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on a circuit board, optimizing space usage.

No. of Terminals: 16

Having 16 terminals provides flexibility in connecting the IC with other components in the system, enabling versatile functionality.

Package Style (Meter): SMALL OUTLINE

Small outline package style helps in reducing overall size of the IC, making it suitable for compact electronic devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can perform reliably under normal operating conditions without risking overheating.

Control Mode: CURRENT/VOLTAGE-MODE

Dual control mode (current/voltage-mode) allows for flexible power management options, adapting to different system requirements.

Minimum Operating Temperature: -20 °C

Being able to operate at a minimum temperature of -20°C ensures functionality in colder environments and harsh conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections for optimal performance.

Terminal Position: DUAL

Dual terminal position enhances flexibility in installation and connection options, accommodating various circuit designs.

Maximum Seated Height: 1.78 mm

Low seated height allows for a compact overall design, ideal for space-constrained applications.

Width (mm): 3.935 mm

Narrow width enables easy integration into PCB layouts with minimal space requirements.

Other IC type: BATTERY CHARGE CONTROLLER

The additional function of battery charge control makes this IC suitable for power management applications requiring battery charging capabilities.

Nominal Input Voltage: 5 V

The 5V nominal input voltage compatibility makes this IC ideal for a wide range of electronic devices powered by standard voltages.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures robust soldering during assembly, enhancing overall reliability of the IC in operation.

Maximum Output Current: 0.005 A

Capable of delivering up to 0.005A of output current, suitable for low power applications requiring precise power management.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable solder connections, ensuring stable electrical performance over the IC's lifespan.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique offers efficient and accurate power management, contributing to energy savings and enhanced performance.

Switcher Config: PUSH-PULL

Push-pull configuration enhances power efficiency and reduces electromagnetic interference, resulting in improved overall system performance.

Terminal Pitch: 1.27 mm

Narrow terminal pitch simplifies PCB layout and assembly, facilitating efficient connection with other components.

Minimum Input Voltage: 4.5 V

With a minimum input voltage of 4.5V, this IC can operate effectively in low voltage conditions, providing reliable power management.

Maximum Input Voltage: 5.5 V

Supporting input voltages up to 5.5V ensures compatibility with a wide range of power sources, making this IC versatile in various applications.

Technical Specifications

Power Management ICs BQ2054SNG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Other IC type:

Control Mode:

CURRENT/VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

5 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.97 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

.005 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.78 mm

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

100 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.935 mm

Trade Compliance

BQ2054SNG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20