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ASP00886IRGCT

Texas Instruments

ASP00886IRGCT by Texas Instruments

Texas Instruments ASP00886IRGCT is a 16-bit microcontroller with MSP430 CPU family, operating at max 32 MHz. Featuring 10-Ch 12-Bit ADCs and PWM channels, it offers I2C(2), SPI(4), UART(2), USB connectivity. Ideal for industrial applications with -40 to 85 °C temp range, it has FLASH ROM programmability and 8192 bytes of RAM.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,254 parts In-Stock

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Digiode

USA . 93 parts In-Stock

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93

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Distributors (Availability)

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AZTECH Wire

Italy . 228 parts In-Stock

1+ parts

$9.149

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-

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228

$9.149

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One Stop Electronics

USA . 456 parts In-Stock

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$20.000

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456

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Parana Technologies

USA . 1,524 parts In-Stock

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$54.242

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1,524

$54.242

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DigiPath Technology Company

USA . 162 parts In-Stock

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$59.727

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$54.949

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162

$59.727

$54.949

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ChromeModa Solutions

Germany . 2,018 parts In-Stock

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$60.946

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$49.976

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2,018

$60.946

$49.976

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IDEA Electronic Components Group

UK . 1,632 parts In-Stock

1+ parts

$60.946

100+ parts

$57.899

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$54.851

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1,632

$60.946

$57.899

$54.851

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Component Stockers USA

USA . 706 parts In-Stock

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$99.990

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706

$99.990

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Microchip USA

USA . 4,973 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,368 parts In-Stock

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Corphita

USA . 2,278 parts In-Stock

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Native Components

USA . 955 parts In-Stock

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Northwest PG Solutions

USA . 663 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments ASP00886IRGCT microcontroller. Designed with precision and quality in mind, this versatile chip offers endless possibilities for applications in various industries. Whether you're looking to enhance your smart home devices, develop innovative IoT solutions, or streamline industrial automation processes, this microcontroller delivers unmatched performance and reliability. With advanced features like multiple ADC and DMA channels, PWM capabilities, and a wide range of connectivity options, the ASP00886IRGCT is the ultimate choice for demanding projects. Trust Texas Instruments to provide top-notch products that exceed expectations and drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with various voltage levels.

Bit Size: 16

With a 16-bit architecture, the microcontroller can handle more complex calculations and operations efficiently.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Provides excellent conductivity and corrosion resistance for reliable terminal connections.

ADC Channels: YES

The presence of Analog to Digital Converter channels allows for accurate conversion of analog signals to digital data.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC architecture microcontroller, it offers high performance and efficiency in executing instructions.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller, making it versatile and suitable for frequent updates.

Connectivity: I2C(2), SPI(4), UART(2), USB

Multiple communication interfaces provide flexibility in connecting the microcontroller to other devices and systems.

Technical Specifications

Microcontrollers ASP00886IRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

47

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

ROM Words:

0

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI(4), UART(2), USB

Peripherals:

COMPARATOR(8), RTC, TIMER(4)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

ASP00886IRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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