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ASP00886IRGCR

Texas Instruments

ASP00886IRGCR by Texas Instruments

Texas Instruments ASP00886IRGCR is a 16-bit microcontroller with 64 terminals, operating at up to 32 MHz. Featuring ADC and DMA channels, it offers connectivity via I2C, SPI, UART, and USB. Ideal for industrial applications requiring a wide temperature range (-40 to 85°C) and low power consumption (2.4-3.6V).

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 8,134 parts In-Stock

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VNN

France . 2,604 parts In-Stock

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Digiode

USA . 1,460 parts In-Stock

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Nova Conductors

Japan . 51 parts In-Stock

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Semicontronic

India . 130 parts In-Stock

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$3.000

100+ parts

$2.925

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$2.910

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130

$3.000

$2.925

$2.910

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AZTECH Wire

Italy . 314 parts In-Stock

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$16.001

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314

$16.001

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One Stop Electronics

USA . 613 parts In-Stock

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$22.000

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613

$22.000

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Ampacity Inc.

Singapore . 1,153 parts In-Stock

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$28.000

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$28.000

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Parana Technologies

USA . 2,154 parts In-Stock

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$48.438

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$48.438

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IDEA Electronic Components Group

UK . 2,154 parts In-Stock

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$54.425

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$51.704

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$48.982

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2,154

$54.425

$51.704

$48.982

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ChromeModa Solutions

Germany . 2,134 parts In-Stock

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$54.425

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$44.628

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Corohmni

South Africa . 891 parts In-Stock

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$81.753

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Argo Parts USA

USA . 4,887 parts In-Stock

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Corphita

USA . 2,953 parts In-Stock

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Continental Prestige Electronics

USA . 2,935 parts In-Stock

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DigiPath Technology Company

USA . 1,747 parts In-Stock

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$49.070

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Texas Instruments MSP430™ Family of Ultra-Low Power Microcontrollers (MCUs) includes several devices featuring different sets of peripherals for various applications. TI's MSP430 features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that attribute to maximum code efficiency. The digitally controlled oscillator allows wakeup from a low-power mode to active mode in less than 6µS. The MSP430 16-bit microcontroller platform of ultra-low power RISC mixed-signal microprocessors from Texas Instruments provides the ultimate solution for a wide range of low power and portable applications. TI provides robust design support for the MSP430 16-bit MCU, including technical documents, training, tools, and software.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability.

Surface Mount: YES

The surface mount option allows for easy installation onto circuit boards, saving time and effort.

Maximum Supply Voltage: 3.6V

With a high maximum supply voltage, this microcontroller can handle various power requirements.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB.

Bit Size: 16

The 16-bit architecture provides enhanced processing power and capabilities.

No. of Terminals: 64

With 64 terminals, this microcontroller can easily interface with multiple components and peripherals.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier, heat sink/slug with a very thin profile design enhances thermal performance and overall efficiency.

Minimum Supply Voltage: 2.4V

The low minimum supply voltage offers flexibility in power options and energy efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in various environments.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it ideal for battery-operated devices.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures functionality in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent conductivity and corrosion resistance.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion for accurate sensor readings.

DMA Channels: YES

The availability of DMA channels allows for efficient data transfer without CPU intervention.

Terminal Position: QUAD

The quad terminal position simplifies PCB layout and connection.

Maximum Seated Height: 1mm

The low seated height makes this microcontroller suitable for compact designs.

Width: 9mm

With a width of 9mm, this microcontroller can fit into tight spaces or small form factor applications.

Peripherals: COMPARATOR(8), RTC, TIMER(4)

The inclusion of multiple peripherals such as comparators, real-time clocks, and timers expands the functionality of the microcontroller.

Maximum Clock Frequency: 32MHz

The high maximum clock frequency allows for fast data processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures proper soldering without damaging the microcontroller.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures durability during manufacturing processes.

Length: 9mm

The length of 9mm contributes to a compact and space-efficient design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes this microcontroller suitable for harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with RISC architecture offers efficient data processing and execution.

RAM Bytes: 8192

With 8192 bytes of RAM, this microcontroller can handle complex computations and data storage.

Technology: CMOS

The CMOS technology ensures low power consumption and high noise immunity.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joint failure and improves reliability.

Analog To Digital Converters: 10-Ch 12-Bit

The 10-channel 12-bit ADCs provide accurate conversion of analog signals to digital data.

Nominal Supply Voltage: 3.3V

The nominal supply voltage of 3.3V offers compatibility with standard power sources.

PWM Channels: YES

The availability of PWM channels allows for precise control of output signals.

Connectivity: I2C(2), SPI(4), UART(2), USB

The multiple connectivity options make interfacing with other devices seamless.

ROM Programmability: FLASH

The flash programmable ROM enables easy and flexible firmware updates.

Terminal Pitch: 0.5mm

The fine terminal pitch of 0.5mm facilitates high-density PCB designs.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates the level of protection against moisture during handling and storage.

Speed: 25 rpm

The speed of 25 rpm ensures efficient data processing and response times.

No. of I/O Lines: 47

With 47 I/O lines, this microcontroller offers versatile connectivity options for input and output peripherals.

Technical Specifications

Microcontrollers ASP00886IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 8 MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

47

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

ROM Words:

0

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), SPI(4), UART(2), USB

Peripherals:

COMPARATOR(8), RTC, TIMER(4)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

ASP00886IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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