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AM26LV32CDG4

Texas Instruments

AM26LV32CDG4 by Texas Instruments

AM26LV32CDG4 by Texas Instruments is a BICMOS technology line receiver with 4 functions, operating at 3.3V. It features EIA-422-B, TIA-422-B, V.11 interface standards and differential Schmitt trigger input characteristics. Ideal for applications requiring high-speed data transmission in commercial temperature grades.

Median Price

$2.110

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 25 parts In-Stock

1+ parts

$2.110

100+ parts

-

1k+ parts

$1.150

10k+ parts

$1.020

25

$2.110

-

$1.150

$1.020

Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$1.160

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300

$1.160

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Digiode

USA . 1,020 parts In-Stock

1+ parts

$2.004

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1,020

$2.004

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Vyrian

USA . 8,745 parts In-Stock

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8,745

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Chip Stock

USA . 4,170 parts In-Stock

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4,170

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VNN

France . 838 parts In-Stock

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838

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Bristol Electronics

USA . 160 parts In-Stock

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160

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Vectronix, Inc

USA . 89 parts In-Stock

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89

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Holdelec - ElecDif-Pro

France . 7 parts In-Stock

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7

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 120 parts In-Stock

1+ parts

$1.110

100+ parts

-

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120

$1.110

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Aranea Global

USA . 50 parts In-Stock

1+ parts

$1.137

100+ parts

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1k+ parts

$1.091

10k+ parts

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50

$1.137

-

$1.091

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Continental Prestige Electronics

USA . 3,688 parts In-Stock

1+ parts

$1.160

100+ parts

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$1.137

3,688

$1.160

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$1.137

Argo Parts USA

USA . 1,727 parts In-Stock

1+ parts

$1.160

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1,727

$1.160

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Ampacity Inc.

Singapore . 25 parts In-Stock

1+ parts

$1.790

100+ parts

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25

$1.790

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Semicontronic

India . 10 parts In-Stock

1+ parts

$1.790

100+ parts

$1.745

1k+ parts

$1.736

10k+ parts

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10

$1.790

$1.745

$1.736

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Corphita

USA . 2,396 parts In-Stock

1+ parts

$1.899

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2,396

$1.899

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Parana Technologies

USA . 832 parts In-Stock

1+ parts

$4.058

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$4.520

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832

$4.058

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$4.520

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DigiPath Technology Company

USA . 1,437 parts In-Stock

1+ parts

$4.468

100+ parts

$4.110

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1,437

$4.468

$4.110

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IDEA Electronic Components Group

UK . 1,806 parts In-Stock

1+ parts

$4.559

100+ parts

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$4.103

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1,806

$4.559

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$4.103

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ChromeModa Solutions

Germany . 715 parts In-Stock

1+ parts

$4.559

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$3.738

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715

$4.559

$3.738

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AZTECH Wire

Italy . 762 parts In-Stock

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$13.380

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762

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A-Z Elektronik GmbH

Germany . 6,938 parts In-Stock

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6,938

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Alle Elektronik GmbH

Germany . 4,625 parts In-Stock

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Microchip USA

USA . 1,723 parts In-Stock

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Overview

Unlock unparalleled performance and reliability with the Texas Instruments AM26LV32CDG4 Line Driver & Receiver. Crafted with precision by a trusted manufacturer, this product ensures seamless communication in various applications. Experience the value of superior quality, efficiency, and versatility that this device brings to your projects. Say goodbye to limitations and hello to limitless possibilities with the AM26LV32CDG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures the product is lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6V provides flexibility and compatibility with a wide range of power sources.

No. of Functions: 4

Having multiple functions in a single device eliminates the need for additional components, simplifying the circuit design and reducing overall costs.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient packing and placement on the PCB, optimizing use of available space.

Maximum Supply Voltage-1: 3.6 V

Having a secondary maximum supply voltage of 3.6V ensures reliable operation even in high voltage scenarios, enhancing product robustness.

Power Supplies (V): 3.3

The 3.3V power supply voltage is commonly used and widely available, making integration into existing systems easier.

No. of Terminals: 16

The 16 terminals provide ample connectivity options, allowing for versatile input/output configurations in diverse applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronic devices and applications with size constraints.

Minimum Supply Voltage-1: 3 V

The low minimum supply voltage of 3V ensures efficient power usage and operation even in low voltage conditions.

Maximum High Level Input Current: 0.00001 Amp

The low high level input current minimizes power consumption and heat generation, enhancing the product's energy efficiency.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C allows for reliable performance in cold environments, expanding the range of possible applications.

Maximum Output Low Current: 5 Amp

The high maximum output low current rating ensures robust performance and the ability to drive various loads effectively.

Receiver No. of Bits: 4

A 4-bit receiver provides sufficient data resolution and accuracy, making this product suitable for applications requiring precise communication.

Maximum Receive Delay: 20 ns

The low maximum receive delay of 20ns ensures fast signal transmission, making the product ideal for high-speed communication systems.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and assembly processes, improving reliability and ease of manufacturing.

Interface Standard: EIA-422-B; TIA-422-B; V.11

Compatibility with multiple interface standards ensures seamless integration with a wide range of devices and systems, enhancing versatility.

Maximum Supply Current: 17 mA

The low maximum supply current requirement of 17mA helps in minimizing power consumption, making the product energy-efficient.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

The use of a differential Schmitt trigger for input characteristics helps in reducing signal noise and ensuring reliable data transmission.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable and consistent operation, contributing to the product's overall reliability.

Interface IC Type: LINE RECEIVER

Being a line receiver interface IC type, this product is specifically designed for signal reception and processing, ensuring accuracy and reliability in data transfer.

Technical Specifications

Line Drivers & Receivers AM26LV32CDG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; V.11

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Low Current:

5 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

20 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

17 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

AM26LV32CDG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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