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AM26LV32CDE4

Texas Instruments

AM26LV32CDE4 by Texas Instruments

AM26LV32CDE4 by Texas Instruments is a Line Driver & Receiver with 4 functions, operating at 3.3V. It features EIA-422-B, TIA-422-B, V.11 interface standards and uses BICMOS technology. Ideal for applications requiring differential Schmitt trigger input characteristics and a max supply current of 17mA.

Median Price

$2.110

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 783 parts In-Stock

1+ parts

$2.110

100+ parts

-

1k+ parts

$1.030

10k+ parts

$0.891

783

$2.110

-

$1.030

$0.891

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$1.160

100+ parts

-

1k+ parts

-

10k+ parts

-

750

$1.160

-

-

-

Digiode

USA . 4,833 parts In-Stock

1+ parts

$2.004

100+ parts

-

1k+ parts

-

10k+ parts

-

4,833

$2.004

-

-

-

Vyrian

USA . 3,160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,160

-

-

-

-

VNN

France . 2,862 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,862

-

-

-

-

Speed Components Ltd

Israel . 12 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,541 parts In-Stock

1+ parts

$1.160

100+ parts

-

1k+ parts

-

10k+ parts

$1.137

5,541

$1.160

-

-

$1.137

Argo Parts USA

USA . 1,439 parts In-Stock

1+ parts

$1.160

100+ parts

-

1k+ parts

-

10k+ parts

-

1,439

$1.160

-

-

-

Ampacity Inc.

Singapore . 660 parts In-Stock

1+ parts

$1.790

100+ parts

-

1k+ parts

-

10k+ parts

-

660

$1.790

-

-

-

Corphita

USA . 4,088 parts In-Stock

1+ parts

$1.899

100+ parts

-

1k+ parts

-

10k+ parts

-

4,088

$1.899

-

-

-

Parana Technologies

USA . 375 parts In-Stock

1+ parts

$10.969

100+ parts

-

1k+ parts

$11.431

10k+ parts

-

375

$10.969

-

$11.431

-

IDEA Electronic Components Group

UK . 2,269 parts In-Stock

1+ parts

$12.325

100+ parts

$11.709

1k+ parts

$11.092

10k+ parts

-

2,269

$12.325

$11.709

$11.092

-

ChromeModa Solutions

Germany . 2,239 parts In-Stock

1+ parts

$12.325

100+ parts

$10.106

1k+ parts

-

10k+ parts

-

2,239

$12.325

$10.106

-

-

AZTECH Wire

Italy . 393 parts In-Stock

1+ parts

$15.906

100+ parts

-

1k+ parts

-

10k+ parts

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393

$15.906

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 7,311 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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7,311

-

-

-

-

Microchip USA

USA . 4,768 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

-

4,768

-

-

-

-

DigiPath Technology Company

USA . 2,079 parts In-Stock

1+ parts

-

100+ parts

$11.112

1k+ parts

-

10k+ parts

-

2,079

-

$11.112

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$1.137

1k+ parts

$1.102

10k+ parts

$1.079

2,000

-

$1.137

$1.102

$1.079

Overview

Elevate your communication systems with the AM26LV32CDE4 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability. This line driver & receiver is designed to deliver seamless transmission across multiple functions, making it ideal for a wide range of applications. With its compact package style and advanced technology, this product offers unmatched value and performance. Upgrade your projects with the AM26LV32CDE4 and experience the benefits of superior connectivity and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes this product lightweight and durable, ideal for applications requiring a sturdy component.

Surface Mount: YES

With the ability to be surface mounted, this product offers ease of installation and integration into circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6V, this product is compatible with a wide range of power sources, offering flexibility in various electrical designs.

No. of Functions: 4

Featuring four functions in one component, this product provides multiple capabilities in a single unit, simplifying circuit design and reducing the need for additional components.

Package Shape: RECTANGULAR

The rectangular package shape of this product allows for efficient use of space on circuit boards, making it suitable for designs with limited area constraints.

Technical Specifications

Line Drivers & Receivers AM26LV32CDE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; V.11

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Low Current:

5 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

20 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

17 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

AM26LV32CDE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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