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AM26LS32ACPWE4

Texas Instruments

AM26LS32ACPWE4 by Texas Instruments

AM26LS32ACPWE4 by Texas Instruments is a 16-terminal line driver/receiver with 4 functions, operating at 5V. It features a max supply voltage of 5.25V, outputting true polarity signals with a peak reflow temperature of 260°C. Ideal for EIA-422-B and TIA-422-B interfaces, it offers differential Schmitt trigger inputs and operates in commercial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,941 parts In-Stock

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Digiode

USA . 2,767 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 287 parts In-Stock

1+ parts

$4.323

100+ parts

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$4.744

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287

$4.323

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$4.744

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IDEA Electronic Components Group

UK . 2,170 parts In-Stock

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$4.857

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$4.371

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$4.857

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ChromeModa Solutions

Germany . 1,048 parts In-Stock

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$4.857

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$3.983

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$4.857

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Native Components

USA . 759 parts In-Stock

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$6.155

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AZTECH Wire

Italy . 766 parts In-Stock

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$15.903

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766

$15.903

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One Stop Electronics

USA . 438 parts In-Stock

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$42.500

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QUARKTWIN TECHNOLOGY LTD

USA . 21,320 parts In-Stock

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Microchip USA

USA . 4,358 parts In-Stock

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Corphita

USA . 3,046 parts In-Stock

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DigiPath Technology Company

USA . 1,586 parts In-Stock

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$4.379

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Northwest PG Solutions

USA . 1,243 parts In-Stock

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Perfect Parts

USA . 1,240 parts In-Stock

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Overview

Experience superior performance and reliability with the Texas Instruments AM26LS32ACPWE4 Line Drivers & Receivers. Known for their exceptional quality and advanced technology, Texas Instruments delivers top-notch products that meet the highest industry standards. The AM26LS32ACPWE4 is perfect for a wide range of applications, offering customers unmatched value and benefits. Trust in Texas Instruments for all your electronic component needs and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and allows for a compact design.

Surface Mount: YES

Enables easy installation on PCBs.

Maximum Supply Voltage: 5.25 V

Supports a wide range of input voltages, increasing compatibility.

No. of Functions: 4

Offers multiple functions in a single component, saving space and cost.

Maximum Operating Temperature: 70 °C

Can operate in relatively high-temperature environments.

Output Characteristics: 3-STATE

Allows for tri-state outputs, enhancing flexibility in data transmission.

Technology: BIPOLAR

Utilizes bipolar technology for reliable and efficient signal processing.

Interface Standard: EIA-422-B; TIA-422-B; EIA-423-B; TIA-423-B; V.10; V.11

Complies with various industry standards, ensuring compatibility with different systems.

Technical Specifications

Line Drivers & Receivers AM26LS32ACPWE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; EIA-423-B; TIA-423-B; V.10; V.11

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

35 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

70 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

AM26LS32ACPWE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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