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AM26LS31CDBRE4

Texas Instruments

AM26LS31CDBRE4 by Texas Instruments

AM26LS31CDBRE4 by Texas Instruments is a Line Driver & Receiver with 4 functions, operating at 5V. It features a max transmit delay of 20ns and differential output. Ideal for EIA-422-B, TIA-422-B, V.11 interfaces in commercial applications requiring fast signal transmission.

Median Price

$12.787

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 100 parts In-Stock

1+ parts

$12.787

100+ parts

$12.148

1k+ parts

$12.148

10k+ parts

-

100

$12.787

$12.148

$12.148

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,447 parts In-Stock

1+ parts

$12.148

100+ parts

-

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1,447

$12.148

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VNN

France . 26,851 parts In-Stock

1+ parts

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26,851

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Vyrian

USA . 4,034 parts In-Stock

1+ parts

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4,034

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Semicontronic

India . 100 parts In-Stock

1+ parts

$10.870

100+ parts

$10.598

1k+ parts

$10.544

10k+ parts

-

100

$10.870

$10.598

$10.544

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Corphita

USA . 2,506 parts In-Stock

1+ parts

$11.508

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2,506

$11.508

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$12.787

100+ parts

$12.148

1k+ parts

$12.148

10k+ parts

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100

$12.787

$12.148

$12.148

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Parana Technologies

USA . 767 parts In-Stock

1+ parts

$12.893

100+ parts

-

1k+ parts

$13.378

10k+ parts

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767

$12.893

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$13.378

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Corohmni

South Africa . 168 parts In-Stock

1+ parts

$13.035

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168

$13.035

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ChromeModa Solutions

Germany . 4,182 parts In-Stock

1+ parts

$14.486

100+ parts

$11.879

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4,182

$14.486

$11.879

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IDEA Electronic Components Group

UK . 1,905 parts In-Stock

1+ parts

$14.486

100+ parts

$13.762

1k+ parts

$13.037

10k+ parts

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1,905

$14.486

$13.762

$13.037

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AZTECH Wire

Italy . 652 parts In-Stock

1+ parts

$16.511

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652

$16.511

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Ampacity Inc.

Singapore . 48 parts In-Stock

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$23.660

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48

$23.660

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Microchip USA

USA . 12,400 parts In-Stock

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Continental Prestige Electronics

USA . 4,386 parts In-Stock

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Argo Parts USA

USA . 3,022 parts In-Stock

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3,022

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DigiPath Technology Company

USA . 1,175 parts In-Stock

1+ parts

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100+ parts

$13.061

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1,175

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$13.061

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Enhance your electronic systems with the AM26LS31CDBRE4 by Texas Instruments, a leading manufacturer known for top-quality components. As part of the Line Drivers & Receivers category, this product offers exceptional performance and reliability. With its innovative design and advanced technology, this product delivers unmatched value, providing customers with efficient and seamless operation. Ideal for a wide range of applications, from telecommunications to industrial automation, the AM26LS31CDBRE4 is the perfect choice for those seeking superior functionality and ease of use in their projects. Trust Texas Instruments for excellence in every detail.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the device lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy installation and compact design, saving space on the PCB.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage provides flexibility in powering the device and ensures stable operation.

No. of Functions: 4

Having multiple functions in one device reduces the need for additional components, simplifying the design and saving costs.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and facilitates easy PCB layout and assembly.

Maximum Transmit Delay: 20 ns

The low transmit delay ensures fast data transfer, making the device suitable for high-speed communication applications.

Maximum High Level Input Current: 0.00002 Amp

The low high-level input current consumption reduces power consumption, making the device energy efficient.

Output Characteristics: 3-STATE

The 3-state output allows the device to be easily controlled and tri-stated, providing flexibility in the output configuration.

Maximum Output Low Current: 20 Amp

The high output current capability ensures compatibility with various loads and provides robust communication.

Differential Output: YES

Differential output offers better noise immunity and common-mode rejection, ensuring reliable data transmission.

Technology: BIPOLAR

Bipolar technology provides fast switching speeds and precise control, making the device suitable for high-speed communication applications.

Interface Standard: EIA-422-B; TIA-422-B; V.11

Compliance with multiple interface standards ensures compatibility with a wide range of communication equipment and systems.

Technical Specifications

Line Drivers & Receivers AM26LS31CDBRE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; V.11

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

20 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

20 ns

Width:

5.3 mm

Trade Compliance

AM26LS31CDBRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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