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AFE7070IRGZ25

Texas Instruments

AFE7070IRGZ25 by Texas Instruments

AFE7070IRGZ25 by Texas Instruments is a 14-bit D/A converter with a supply voltage of 1.8V, operating b/w -40 to 85°C. It comes in a square chip carrier package with 48 terminals and is suitable for industrial applications requiring precise analog signal generation.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,843 parts In-Stock

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Digiode

USA . 518 parts In-Stock

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518

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Distributors (Availability)

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AZTECH Wire

Italy . 572 parts In-Stock

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$8.696

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572

$8.696

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Parana Technologies

USA . 1,557 parts In-Stock

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$9.768

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$10.342

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$9.768

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ChromeModa Solutions

Germany . 2,928 parts In-Stock

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$10.975

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$9.000

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IDEA Electronic Components Group

UK . 2,320 parts In-Stock

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$10.975

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$10.426

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$9.878

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2,320

$10.975

$10.426

$9.878

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One Stop Electronics

USA . 141 parts In-Stock

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$14.000

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$14.000

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Native Components

USA . 381 parts In-Stock

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$38.740

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$37.190

381

$38.740

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$37.190

Northwest PG Solutions

USA . 134 parts In-Stock

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$42.614

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Corphita

USA . 1,558 parts In-Stock

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DigiPath Technology Company

USA . 1,374 parts In-Stock

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$9.895

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Microchip USA

USA . 363 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of precision with the AFE7070IRGZ25 by Texas Instruments. Crafted with premium quality materials and cutting-edge technology, this digital-to-analog converter offers unparalleled performance in a compact square package. Ideal for a wide range of applications, from industrial automation to automotive electronics, this product delivers exceptional value, reliability, and efficiency. Experience seamless integration, superior functionality, and enhanced control with the AFE7070IRGZ25. Elevate your projects to new heights with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and resistant to environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation of the digital-to-analog converter on circuit boards, saving space and ensuring a reliable connection.

No. of Bits: 14

With 14 bits, this converter offers high resolution and accuracy in converting digital signals to analog, making it suitable for applications that require precision.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability and stability in various operating environments, making it suitable for industrial use.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage of 1.8V allows for efficient power consumption and compatibility with low-power devices, making it energy-efficient.

Technical Specifications

Digital-to-Analog Converters AFE7070IRGZ25 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Input Format:

Parallel, Word

Input Bit Code:

Binary

No. of Bits:

14

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

1.8 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

48

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Trade Compliance

AFE7070IRGZ25 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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