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ADS8513IDWG4

Texas Instruments

ADS8513IDWG4 by Texas Instruments

The Texas Instruments ADS8513IDWG4 is a 16-bit ADC with 0.0046% linearity error, 20us conversion time, and 0.04MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,721 parts In-Stock

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Digiode

USA . 734 parts In-Stock

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734

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Chip Stock

USA . 225 parts In-Stock

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225

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Distributors (Availability)

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AZTECH Wire

Italy . 711 parts In-Stock

1+ parts

$10.588

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711

$10.588

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One Stop Electronics

USA . 882 parts In-Stock

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$18.000

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882

$18.000

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Parana Technologies

USA . 2,235 parts In-Stock

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$24.878

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$25.569

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$24.878

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$25.569

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DigiPath Technology Company

USA . 422 parts In-Stock

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$27.394

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422

$27.394

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ChromeModa Solutions

Germany . 1,009 parts In-Stock

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$27.953

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$22.921

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$27.953

$22.921

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IDEA Electronic Components Group

UK . 860 parts In-Stock

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$27.953

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$26.555

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$25.158

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860

$27.953

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$25.158

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Native Components

USA . 523 parts In-Stock

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$94.774

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$90.983

523

$94.774

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$90.983

Northwest PG Solutions

USA . 1,733 parts In-Stock

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$104.251

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$104.251

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A-Z Elektronik GmbH

Germany . 5,355 parts In-Stock

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Microchip USA

USA . 4,105 parts In-Stock

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Corphita

USA . 3,696 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,570 parts In-Stock

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Overview

Unlock the power of precision with the ADS8513IDWG4 Analog-to-Digital Converter from Texas Instruments. Designed with quality and reliability in mind, this innovative converter offers seamless conversion with a maximum linearity error of just 0.0046%. Ideal for industrial applications, this small outline package delivers high performance with a sample rate of 0.04 MHz and a maximum conversion time of 20 us. Experience the value of accurate data acquisition and take your projects to the next level with the ADS8513IDWG4.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Bits: 16

Provides high resolution and accuracy in converting analog signals to digital, ensuring precise measurements.

Maximum Linearity Error (EL): 0.0046%

Ensures minimal distortion or error in the conversion process, resulting in accurate digital representations of analog signals.

Power Supplies (V): 5

Operates on a standard power supply voltage, making it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments where heat may be a factor.

Maximum Conversion Time: 20 us

Provides fast conversion speeds, ideal for real-time applications that require quick data processing.

Maximum Analog Input Voltage: 10 V

Handles a wide range of input voltages, making it versatile for different types of analog signals.

Technical Specifications

Analog-to-Digital Converters ADS8513IDWG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0046 %

Sample Rate:

40 kHz

Hold Mode:

Sample

Maximum Conversion Time:

20 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

-10 V

Maximum Analog Input Voltage:

10 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

4.75 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.406 in (10.3 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP16,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G16

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8513IDWG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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