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ADS8509IBDBG4

Texas Instruments

ADS8509IBDBG4 by Texas Instruments

ADS8509IBDBG4 by Texas Instruments is a 16-bit ADC with 0.0031% linearity error, 3 analog in channels, and 2.2us conversion time. Ideal for industrial applications requiring precise analog-to-digital conversion at temperatures ranging from -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Digiode

USA . 4,155 parts In-Stock

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Vyrian

USA . 3,710 parts In-Stock

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Chip Stock

USA . 2,700 parts In-Stock

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2,700

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VNN

France . 909 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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One Stop Electronics

USA . 801 parts In-Stock

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$3.000

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801

$3.000

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AZTECH Wire

Italy . 482 parts In-Stock

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$7.206

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Corohmni

South Africa . 235 parts In-Stock

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$15.608

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Parana Technologies

USA . 215 parts In-Stock

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$18.046

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$18.196

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Ampacity Inc.

Singapore . 965 parts In-Stock

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$19.000

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$19.000

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DigiPath Technology Company

USA . 1,499 parts In-Stock

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$19.870

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$18.281

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ChromeModa Solutions

Germany . 6,131 parts In-Stock

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$20.276

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$16.626

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IDEA Electronic Components Group

UK . 1,479 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$20.757

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$18.889

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$17.021

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$20.757

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Semicontronic

India . 848 parts In-Stock

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$24.375

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Corphita

USA . 4,052 parts In-Stock

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Argo Parts USA

USA . 2,878 parts In-Stock

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Microchip USA

USA . 2,391 parts In-Stock

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Continental Prestige Electronics

USA . 2,117 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Experience the unparalleled precision and reliability of Texas Instruments with the ADS8509IBDBG4 Analog-to-Digital Converter. This top-of-the-line device offers cutting-edge technology in a compact, easy-to-use package. Whether you're working in industrial automation, automotive systems, or telecommunications, this converter delivers superior performance, accuracy, and efficiency. Trust Texas Instruments to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection, making the product long-lasting.

No. of Analog In Channels: 3

Having multiple analog input channels allows for versatile and flexible input options.

Surface Mount: YES

Being surface mountable makes installation easy and saves space on the PCB.

No. of Functions: 1

With one function, the product is straightforward and easy to use.

Package Shape: RECTANGULAR

The rectangular shape allows for easy design and integration into various systems.

No. of Bits: 16

The high number of bits ensures accurate and precise conversion of analog signals.

Maximum Linearity Error (EL): 0.0031%

This low error rate ensures high accuracy in signal conversion.

Power Supplies (V): 5

Operating at 5V makes this product compatible with standard power sources.

No. of Terminals: 28

Having multiple terminals provides versatile connectivity options.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

This compact package style saves space on the PCB.

Technical Specifications

Analog-to-Digital Converters ADS8509IBDBG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

3

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0031 %

Sample Rate:

2.5 kHz

Hold Mode:

Sample

Maximum Conversion Time:

2.2 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

-10 V

Maximum Analog Input Voltage:

10 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

4.75 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.402 in (10.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP28,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8509IBDBG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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