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ADS8509HDB

Texas Instruments

ADS8509HDB by Texas Instruments

The Texas Instruments ADS8509HDB is a 16-bit ADC with 0.0069% EL, 5V supply, and 0.25 MHz sample rate. Ideal for automotive applications, it features a CMOS technology, BINARY output code, and SERIAL output format.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,628 parts In-Stock

1+ parts

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7,628

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Digiode

USA . 2,804 parts In-Stock

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2,804

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 575 parts In-Stock

1+ parts

$6.404

100+ parts

-

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575

$6.404

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Native Components

USA . 69 parts In-Stock

1+ parts

$14.769

100+ parts

-

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69

$14.769

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Northwest PG Solutions

USA . 2,321 parts In-Stock

1+ parts

$16.245

100+ parts

$14.621

1k+ parts

-

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2,321

$16.245

$14.621

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Parana Technologies

USA . 1,632 parts In-Stock

1+ parts

$18.905

100+ parts

-

1k+ parts

$18.979

10k+ parts

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1,632

$18.905

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$18.979

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DigiPath Technology Company

USA . 2,263 parts In-Stock

1+ parts

$20.817

100+ parts

$19.152

1k+ parts

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2,263

$20.817

$19.152

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ChromeModa Solutions

Germany . 6,456 parts In-Stock

1+ parts

$21.242

100+ parts

$17.418

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6,456

$21.242

$17.418

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IDEA Electronic Components Group

UK . 1,599 parts In-Stock

1+ parts

$21.242

100+ parts

$20.180

1k+ parts

$19.118

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1,599

$21.242

$20.180

$19.118

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One Stop Electronics

USA . 662 parts In-Stock

1+ parts

$28.000

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662

$28.000

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Corphita

USA . 340 parts In-Stock

1+ parts

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340

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Microchip USA

USA . 151 parts In-Stock

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151

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Overview

Experience the ultimate in precision and performance with the Texas Instruments ADS8509HDB Analog-to-Digital Converter. Manufactured by industry leader Texas Instruments, this high-quality converter offers unparalleled accuracy and reliability for a wide range of applications. Whether you're working in automotive, industrial, or consumer electronics, the ADS8509HDB delivers exceptional value, benefits, and advantages to meet your specific needs. Upgrade to the ADS8509HDB today and elevate your projects to new heights of excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

No. of Bits: 16

With a high resolution of 16 bits, this ADC can provide accurate and detailed digital conversions.

Maximum Linearity Error (EL): 0.0069 %

The low linearity error ensures precise conversion of analog signals to digital without significant distortion.

Sample Rate: 0.25 MHz

The high sample rate of 0.25 MHz allows for fast and efficient conversion of analog signals, making it suitable for various applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the ADC reliable and efficient.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that the ADC can operate effectively in harsh temperature conditions, making it suitable for automotive applications.

Technical Specifications

Analog-to-Digital Converters ADS8509HDB attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0069 %

Sample Rate:

250 kHz

Hold Mode:

Sample

Maximum Conversion Time:

2.2 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

-10 V

Maximum Analog Input Voltage:

10 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

4

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

175 °C (347 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.402 in (10.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP28,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8509HDB Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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