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ADS8411IPFBRG4

Texas Instruments

ADS8411IPFBRG4 by Texas Instruments

Texas Instruments' ADS8411IPFBRG4 is a 16-bit ADC with 0.0092% EL, 2 MHz sample rate, and 0.4 us conversion time. Ideal for industrial applications, it operates at -40 to 85 °C with a max analog input voltage of 4.2 V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,872 parts In-Stock

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3,872

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Digiode

USA . 1,850 parts In-Stock

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1,850

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Distributors (Availability)

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Northwest PG Solutions

USA . 1,243 parts In-Stock

1+ parts

$3.562

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1,243

$3.562

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Parana Technologies

USA . 127 parts In-Stock

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$12.707

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-

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$13.176

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127

$12.707

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$13.176

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DigiPath Technology Company

USA . 865 parts In-Stock

1+ parts

$13.992

100+ parts

$12.873

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865

$13.992

$12.873

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ChromeModa Solutions

Germany . 6,080 parts In-Stock

1+ parts

$14.278

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$11.708

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6,080

$14.278

$11.708

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IDEA Electronic Components Group

UK . 407 parts In-Stock

1+ parts

$14.278

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$13.564

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$12.850

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407

$14.278

$13.564

$12.850

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AZTECH Wire

Italy . 843 parts In-Stock

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$18.369

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843

$18.369

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One Stop Electronics

USA . 719 parts In-Stock

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$34.000

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$34.000

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Corphita

USA . 1,866 parts In-Stock

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Microchip USA

USA . 258 parts In-Stock

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Native Components

USA . 207 parts In-Stock

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$3.141

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Overview

Elevate your designs with the ADS8411IPFBRG4 by Texas Instruments, a premium Analog-to-Digital Converter that delivers unparalleled quality and precision. With Texas Instruments' reputation for excellence in semiconductor manufacturing, this product surpasses expectations in industrial applications. Its fast sampling rate and low linearity error ensure accurate data conversion in a compact package. Experience the value and benefits of seamless integration and reliable performance with the ADS8411IPFBRG4, setting a new standard in analog-to-digital conversion technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the converter, ensuring long-term reliability.

No. of Bits: 16

Higher number of bits allows for greater resolution and accuracy in converting analog signals to digital.

Maximum Linearity Error (EL): 0.0092%

Low linearity error ensures that the digital output accurately represents the input analog signal, leading to high precision.

Power Supplies (V): 3/5,5

Versatile power supply options allow for compatibility with different systems and voltage requirements.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in various environments.

Maximum Conversion Time: 0.4 us

Fast conversion time enables quick response and real-time processing of analog signals.

Output Bit Code: BINARY

Binary output format simplifies data processing and integration with digital systems.

Sample and Hold/Track and Hold: SAMPLE

Sample and hold feature ensures accurate sampling of analog signals, preventing signal distortion or loss during conversion.

Technical Specifications

Analog-to-Digital Converters ADS8411IPFBRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits, Parallel, Word

Maximum Linearity Error (EL):

0.0092 %

Sample Rate:

2 MHz

Hold Mode:

Sample

Maximum Conversion Time:

400 ns

Electrical Specifications

Power Supplies:

3/5,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP48,.35SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

Trade Compliance

ADS8411IPFBRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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